Patents by Inventor Ken Yahata
Ken Yahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240413179Abstract: An imaging device according to an embodiment of the present disclosure includes: a semiconductor substrate having a first surface and a second surface opposed to each other, the semiconductor substrate including a plurality of pixels disposed in a matrix, and a plurality of photoelectric converters that each generates, through photoelectric conversion, electric charge corresponding to an amount of received light for each of the pixels; a plurality of color filters provided on a side of the first surface in respective ones of the plurality of pixels; a plurality of condensing lenses provided on a light incident side of the plurality of color filters in the respective ones of the plurality of pixels; and a separation wall provided between the plurality of color filters adjacent to each other on the side of the first surface, the separation wall having a line width on the light incident side narrower than the line width of the separation wall on the side of the first surface.Type: ApplicationFiled: October 13, 2022Publication date: December 12, 2024Inventors: YUKA OHKUBO, KAZUHIRO GOI, TAICHI NATORI, YUSUKE MORIYA, SHINGO TAKAHASHI, KEN YAHATA, HIROSHI KATO
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Publication number: 20110294941Abstract: Provided is a vinyl chloride-based resin composition including a vinyl chloride-based resin and a titanium dioxide having an average particle diameter of 5 to 50 nm, in an amount of 1,000 ppm to 10,000 ppm, by mass, relative to the mass of the vinyl chloride-based resin. By adding a titanium dioxide having an average particle diameter of 5 to 50 nm to a vinyl chloride-based resin in an amount described above, a vinyl chloride-based resin composition of excellent thermal stability can be obtained. In the vinyl chloride-based resin composition, the crystalline form of the titanium dioxide is preferably anatase, rutile, or a combination thereof.Type: ApplicationFiled: May 25, 2011Publication date: December 1, 2011Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tatsuya FUJIMOTO, Tadashi Amano, Manabu Furudate, Tomohiro Inoue, Shinji Fujimoto, Ken Yahata
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Patent number: 7847012Abstract: A thermally expandable vinyl chloride resin composition is provided. It includes (A) 100 parts by mass of a vinyl chloride resin, (B) 5 to 200 parts by mass of an inorganic filler, (C) 10 to 300 parts by mass of a thermally expandable graphite, (D) 0.1 to 10 parts by mass of a fluororesin, and (E) 10 to 300 parts by mass of a phosphorus compound. The composition exhibits favorable thermal expansion properties and favorable shape retention following thermal expansion upon exposure to high temperatures.Type: GrantFiled: June 5, 2007Date of Patent: December 7, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
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Patent number: 7514495Abstract: The present invention provides an antistatic agent for vinyl chloride-based resins which can impart superior antistatic properties to the vinyl chloride-based resin, and which can thereby solve various problems arising from charging of the vinyl chloride-based resin with static electricity, a vinyl chloride-based resin composition containing this antistatic agent, and a method for manufacturing this composition. The present invention provides an antistatic agent for vinyl chloride-based resins which consists of silica particles containing at least 99.0% by mass of SiO2 and 0.00005% 80.5 ppm by mass or less of sodium, and which has such a particle size distribution that at least 98% by mass of the silica particles is occupied by the particles having a particle diameter in the range from 30 to 1,000 nm.Type: GrantFiled: May 9, 2006Date of Patent: April 7, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
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Publication number: 20070282027Abstract: A thermally expandable vinyl chloride resin composition is provided. It includes (A) 100 parts by mass of a vinyl chloride resin, (B) 5 to 200 parts by mass of an inorganic filler, (C) 10 to 300 parts by mass of a thermally expandable graphite, (D) 0.1 to 10 parts by mass of a fluororesin, and (E) 10 to 300 parts by mass of a phosphorus compound. The composition exhibits favorable thermal expansion properties and favorable shape retention following thermal expansion upon exposure to high temperatures.Type: ApplicationFiled: June 5, 2007Publication date: December 6, 2007Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
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Publication number: 20060257660Abstract: The present invention provides an antistatic agent for vinyl chloride-based resins which can impart superior antistatic properties to the vinyl chloride-based resin, and which can thereby solve various problems arising from charging of the vinyl chloride-based resin with static electricity, a vinyl chloride-based resin composition containing this antistatic agent, and a method for manufacturing this composition. The present invention provides an antistatic agent for vinyl chloride-based resins which consists of silica particles containing at least 99.0% by mass of SiO2 and 0.00005% 80.5 ppm by mass or less of sodium, and which has such a particle size distribution that at least 98% by mass of the silica particles is occupied by the particles having a particle diameter in the range from 30 to 1,000 nm.Type: ApplicationFiled: May 9, 2006Publication date: November 16, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
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Patent number: 6143409Abstract: Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:.paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.nwherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.Type: GrantFiled: November 25, 1998Date of Patent: November 7, 2000Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yasuyoshi Komoto, Akira Hayashida, Michio Aizawa, Hitoshi Arai, Ken Yahata
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Patent number: 5916675Abstract: Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:.paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.nwherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.Type: GrantFiled: June 12, 1997Date of Patent: June 29, 1999Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yasuyoshi Komoto, Akira Hayashida, Michio Aizawa, Hitoshi Arai, Ken Yahata
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Patent number: 5837801Abstract: The method for preparing a crosslinked polycarbodiimide according to the present invention comprises reacting a polydicarbodiimide compound with a compound, which has in a molecule thereof two or more hydroxy or mercapto groups, in the presence of an alcoholate of an alkali metal or of an alkaline earth metal. The crosslinked polycarbodiimide obtained according to the method is excellent in heat resistance and mechanical properties.Type: GrantFiled: December 4, 1996Date of Patent: November 17, 1998Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ken Yahata, Hiroshi Miyoshi, Yasuyuki Takiguchi, Yasuyoshi Komoto, Akira Hayashida
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Patent number: 5821325Abstract: A hydroxy- or mercapto-bearing organic compound is caused to react with a polycarbodiimide compound in the presence of an alcoholate of an alkali metal or of an alkaline earth metal. The carbodiimide linkage in the polymer which results from the above-described reaction is crosslinked.Type: GrantFiled: December 10, 1996Date of Patent: October 13, 1998Assignee: Shin-Estu Chemical Co., Ltd.Inventors: Ken Yahata, Yasuyuki Takiguchi, Hiroshi Miyoshi, Yasuyoshi Komoto, Akira Hayashida
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Patent number: 5770661Abstract: A polycarbodiimide compound is reacted with an organic compound having at least two amino groups in the molecule. A polycarbodiimide compound is reacted with an amine compound having a silicon atom in the molecule. The carbodiimide bonds remained in the crosslinked material are further crosslinked. The crosslinked material is further heated/calcined to obtain an inorganic material having high heat resistance and strong toughness.Type: GrantFiled: January 13, 1997Date of Patent: June 23, 1998Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Miyoshi, Ken Yahata, Yasuyoshi Komoto, Yasuyuki Takiguchi, Akira Hayashida
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Patent number: 5750636Abstract: This invention provides a process wherein a stable solution of polycarbodiimide with a number-average molecular-weight of 5,000 to 60,000 can be very easily prepared by using an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) as starting material, a cyclic phosphine oxide as catalyst and a chlorinated aromatic compound as solvent and by controlling certain reaction conditions within the reaction temperature range of 110.degree. to 150.degree. C.Type: GrantFiled: June 4, 1996Date of Patent: May 12, 1998Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yasuyoshi Komoto, Yasuyuki Takiguchi, Ken Yahata, Akira Hayashida, Minoru Takamizawa
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Patent number: 5750637Abstract: This invention provides a process for the preparation of a polycarbodiimide solution wherein the polycarbodiimide is synthesized by heating an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) in the presence of a carbodiimidation catlayst characterized in that a non-chlorinated aromatic hydrocarbon is used as the solvent and the resulting polycarbodiimide has a number average molecular weight from about 3,000 to about 10,000; wherein the synthesis is performed in the temperature range of from about 100.degree. to about 120.degree. C.Type: GrantFiled: June 4, 1996Date of Patent: May 12, 1998Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yasuyuki Takiguchi, Ken Yahata, Yasuyoshi Komoto, Akira Hayashida, Minoru Takamizawa
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Patent number: 5436127Abstract: A peptide having an amino acid sequence represented by the following formula: Ser-Thr-Lys-Glu-Gly-Asp-Ser-Ser-Asn-Thr-Gly-Ala-Gly-Lys-Ala-Leu-Thr-Gly-Le u-Ser-Thr-Gly specifically reacts with antibodies against human parvovirus B19. Therefore, this peptide can be used in agents for detecting antibodies against human parvovirus B19 and in methods for detecting antibodies against human parvovirus B19.Type: GrantFiled: October 21, 1993Date of Patent: July 25, 1995Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ken Yahata, Yasuyoshi Koumoto, Tohru Chiba, Tadasu Nunoue