Patents by Inventor Ken Yew

Ken Yew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6746238
    Abstract: The present invention relates to a cooling system of a furnace, and more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: June 8, 2004
    Assignee: United Microelectronics Corp.
    Inventors: Eric Chu, Kevin Chiang, Ling-Hsin Tseng, Ken Yew
  • Publication number: 20020110770
    Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.
    Type: Application
    Filed: April 12, 2002
    Publication date: August 15, 2002
    Applicant: United Microelectronics Corp.
    Inventors: Eric Chu, Kevin Chiang, Ling-Hsin Tseng, Ken Yew
  • Publication number: 20020106602
    Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.
    Type: Application
    Filed: February 5, 2001
    Publication date: August 8, 2002
    Inventors: Eric Chu, Kevin Chiang, Ling-Hsin Tseng, Ken Yew
  • Patent number: 6427470
    Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The probability of pollution by particles can be decreased and the lifetime of the furnace devices can be extended by using different liquid and gas cycles, cooling the different steps the semiconductor processes in the furnace.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: August 6, 2002
    Assignee: United Microelectronics Corp.
    Inventors: Eric Chu, Kevin Chiang, Ling-Hsin Tseng, Ken Yew