Patents by Inventor Ken Yoshioka
Ken Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11226495Abstract: A screwless hinge system for connecting a temple to a front frame portion of eyewear includes a hooked tab with a single hook and a base. The hooked tab extends through the front frame portion and a u-spring until the base engages the frame. A temple receiver of a temple compresses the u-spring and engages the single hook, allowing for opening and closing of the temple and removal and replacement of the temple without tools.Type: GrantFiled: January 27, 2020Date of Patent: January 18, 2022Assignees: Marchon Eyewear, Inc., Nakanishi Optical Products Corp.Inventors: Alessandro Pol, Massimiliano Maccanti, Nicole M. Troiano, Rachael N. Milluzzi, Keiichi Nakanishi, Masahide Nishida, Ken Yoshioka, Takashi Sawa
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Publication number: 20210388227Abstract: This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.Type: ApplicationFiled: November 5, 2019Publication date: December 16, 2021Inventors: Keiko OHTSUKA, Morio YONEKAWA, Hajime KIMURA, Ken YOSHIOKA, Nobuhiro KANAMARU, Masaki SUWA, Kazumi MACHIDA
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Patent number: 11065985Abstract: A vehicle seat device includes a seat main body having a seat cushion and a seatback, and a tilt device configured to exert a tilt function to tilt the seatback towards a seat front side. The tilt device includes an electric motor and a spring. The electric motor is configured to exert a rotational force to rotationally displace the seatback. The spring is configured to exert a resilient force to rotationally displace the seatback towards the seat front side.Type: GrantFiled: January 2, 2020Date of Patent: July 20, 2021Assignees: TOYOTA BOSHOKU KABUSHIKI KAISHA, MAZDA MOTOR CORPORATIONInventors: Yasuhiko Maekawa, Shotaro Aratake, Ken Yoshioka
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Publication number: 20200241319Abstract: A screwless hinge system for connecting a temple to a front frame portion of eyewear includes a hooked tab with a single hook and a base. The hooked tab extends through the front frame portion and a u-spring until the base engages the frame. A temple receiver of a temple compresses the u-spring and engages the single hook, allowing for opening and closing of the temple and removal and replacement of the temple without tools.Type: ApplicationFiled: January 27, 2020Publication date: July 30, 2020Inventors: Alessandro Pol, Massimiliano Maccanti, Nicole M. Troiano, Rachael N. Milluzzi, Keiichi Nakanishi, Masahide Nishida, Ken Yoshioka, Takashi Sawa
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Publication number: 20200215935Abstract: A vehicle seat device includes a seat main body having a seat cushion and a seatback, and a tilt device configured to exert a tilt function to tilt the seatback towards a seat front side. The tilt device includes an electric motor and a spring. The electric motor is configured to exert a rotational force to rotationally displace the seatback. The spring is configured to exert a resilient force to rotationally displace the seatback towards the seat front side.Type: ApplicationFiled: January 2, 2020Publication date: July 9, 2020Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, Mazda Motor CorporationInventors: Yasuhiko MAEKAWA, Shotaro ARATAKE, Ken YOSHIOKA
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Patent number: 9378929Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.Type: GrantFiled: January 22, 2015Date of Patent: June 28, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Kenji Maeda, Ken Yoshioka, Hiromichi Kawasaki, Takahiro Shimomura
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Publication number: 20150221477Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.Type: ApplicationFiled: January 22, 2015Publication date: August 6, 2015Inventors: Kenji MAEDA, Ken YOSHIOKA, Hiromichi KAWASAKI, Takahiro SHIMOMURA
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Patent number: 9039865Abstract: The invention provides a plasma processing apparatus in which ring-like conductors 8a and 8b are arranged closed to and along an induction antenna 1 composed of an inner circumference coil 1a and an outer circumference coil 1b. Ring-like conductors 8a and 8b are each characterized in that the radius from the center of the apparatus and the cross-sectional shape of the conductor body varies along the circumferential angle of the coils. Since the mutual inductances between the ring-like conductors 8a and 8b and the induction antenna 1 and between the ring-like conductors 8a and 8b and the plasma along the circumferential position are controlled, it becomes possible to compensate for the coil currents varied along the circumference of the coils of the induction antenna 1, and to improve the non-uniformity in the circumferential direction of the current in the generated plasma.Type: GrantFiled: January 27, 2010Date of Patent: May 26, 2015Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Ken Yoshioka, Motohiko Yoshigai, Ryoji Nishio, Tadayoshi Kawaguchi
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Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device
Patent number: 9017786Abstract: In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.Type: GrantFiled: August 10, 2012Date of Patent: April 28, 2015Assignee: Tokyo Electron LimitedInventors: Ken Yoshioka, Syuichi Takahashi, Yasuharu Sasaki -
Patent number: 8951385Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.Type: GrantFiled: April 17, 2013Date of Patent: February 10, 2015Assignee: Hitachi High-Technologies CorporationInventors: Kenji Maeda, Ken Yoshioka, Hiromichi Kawasaki, Takahiro Shimomura
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Patent number: 8940128Abstract: The invention aims at suppressing the self bias generated at the surface of the inner wall of the vacuum processing chamber, to thereby suppress the chipping of the inner wall surface of the vacuum processing chamber or the consumption of the inner parts of the vacuum processing chamber. The present invention provides a plasma processing apparatus comprising a vacuum processing chamber, a vacuum processing chamber lid sealing an upper portion of the vacuum processing chamber, an induction antenna, a Faraday shield disposed between the induction antenna and the vacuum processing chamber lid, and a high frequency power supply for supplying high frequency power to the induction antenna, wherein the induction antenna is divided into two or more parts, the Faraday shield is divided into a division number corresponding to the division number of the induction antenna, and high frequency voltages are applied thereto via a matching box from the one high frequency power supply.Type: GrantFiled: August 10, 2010Date of Patent: January 27, 2015Assignee: Hitachi High-Technologies CorporationInventors: Yusaku Sakka, Ryoji Nishio, Ken Yoshioka
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Patent number: 8795467Abstract: A plasma processing apparatus includes a sample stage disposed at a lower part of a processing chamber, a bell jar made of an insulative material constituting an upper portion of a vacuum vessel, a coil antenna disposed outside and around the bell jar to which electric power is supplied so as to generate the plasma in a plasma generating space inside of the bell jar, and a Faraday shield mounted on the bell jar and disposed between an external surface of the bell jar and the coil antenna. A ring shaped member made of an electric conductive material is disposed inside of an inner surface of a ring portion of the processing chamber located below a skirt portion of the bell jar and constitutes a part of the processing chamber. The ring shaped member extends upwardly so as to cover a portion of an inner surface of the bell jar.Type: GrantFiled: October 8, 2009Date of Patent: August 5, 2014Assignee: Hitachi High Technologies CorporationInventors: Ryoji Nishio, Ken Yoshioka, Saburou Kanai, Tadamitsu Kanekiyo, Hideki Kihara, Koji Okuda
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Publication number: 20130267098Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.Type: ApplicationFiled: April 17, 2013Publication date: October 10, 2013Inventors: Kenji MAEDA, Ken YOSHIOKA, Hiromichi KAWASAKI, Takahiro SHIMOMURA
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METHOD AND APPARATUS FOR REPAIRING AN ELECTROSTATIC CHUCK DEVICE, AND THE ELECTROSTATIC CHUCK DEVICE
Publication number: 20120300357Abstract: In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.Type: ApplicationFiled: August 10, 2012Publication date: November 29, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Ken Yoshioka, Syuichi Takahashi, Yasuharu Sasaki -
Publication number: 20120273136Abstract: A plasma processing apparatus includes a processing chamber, a sample stage, a radio-frequency power supply which enables generation of plasma in the processing chamber, and at least one induction coil. The induction coil is formed by connecting a plurality of identical coil elements so that a same radio-frequency voltage is applied to each of the plurality of identical coil elements, and each input terminals of the identical coil elements is displaced at intervals of an angle calculated by dividing 360° by the number of identical coil elements. Continuous conductor portions of the identical coil elements are formed on different adjacent surfaces of the annular ring and constituted so as to be displaced from one another for a predetermined angle at a time so as to extend along a circumferential direction of the different adjacent surfaces of the annular ring.Type: ApplicationFiled: July 10, 2012Publication date: November 1, 2012Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
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Patent number: 8282848Abstract: A plasma processing apparatus includes: a film which is made of an insulative material and constructs a surface of a sample stage on which a sample is put; a disk-shaped member whose upper surface is joined with the film in a lower portion of the film and which is made of a heat conductive member; heaters which are arranged in the film and arranged in a center portion and regions of its outer peripheral side of the film; coolant channels which are arranged in the disk-shaped member and in which a coolant for cooling the disk-shaped member flows; a plurality of power sources each of which adjusts an electric power to each of the heaters in the plurality of regions; and a controller which adjusts outputs from the plurality of power sources by using a result obtained by presuming a temperature of the upper surface of the disk-shaped member.Type: GrantFiled: February 28, 2008Date of Patent: October 9, 2012Assignee: Hitachi High-Technologies CorporationInventors: Yutaka Ohmoto, Mamoru Yakushiji, Yutaka Kouzuma, Ken Yoshioka, Tsunehiko Tsubone
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Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device
Patent number: 8252132Abstract: In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.Type: GrantFiled: January 13, 2010Date of Patent: August 28, 2012Assignee: Tokyo Electron LimitedInventors: Ken Yoshioka, Syuichi Takahashi, Yasuharu Sasaki -
Patent number: 8231759Abstract: A plasma processing apparatus includes a processing chamber, a sample stage for mounting an object to be processed, a power supply, and at least one induction coil connected to the power supply. The induction coil is formed by connecting at least two identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage. The induction coil is positioned so that a center thereof corresponds to a center of the object, and input ends of the coil elements are displaced circumferentially at equal angular intervals calculated by dividing 360° by the number of identical coil elements.Type: GrantFiled: May 20, 2010Date of Patent: July 31, 2012Assignee: Hitachi High-Technologies CorporationInventors: Manabu Edamura, Go Miya, Ken Yoshioka
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Patent number: 8092637Abstract: A manufacturing method includes steps of: placing a film composed of dielectric, on the top surface of a sample stage, forming a film-like heater on the film made of the dielectric, supplying power to the heater to detect a temperature distribution, adjusting a resistance value of the heater on the basis of a result of detection of a temperature distribution so that the temperature distribution has a predetermined value, and then forming the film composed of the dielectric, on the heater.Type: GrantFiled: February 28, 2008Date of Patent: January 10, 2012Assignee: Hitachi High-Technologies CorporationInventors: Yutaka Kouzuma, Yutaka Ohmoto, Mamoru Yakushiji, Ken Yoshioka, Tsunehiko Tsubone
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Publication number: 20120000774Abstract: A plasma processing apparatus includes a processing chamber to be depressurized and exhausted, a sample placement electrode provided in the processing chamber and having a sample placement surface on which a substrate to be processed is placed, an electromagnetic generation device to generate plasma in the processing chamber, a supply system that supplies processing gas to the processing chamber, a vacuum exhaust system that exhausts inside the processing chamber, a heater layer and a base temperature monitor that are disposed on the sample placement electrode, a wafer temperature estimating unit that estimates a wafer temperature from the base temperature monitor and plasma forming power supply, and a controller that regulates the heater corresponding to output from the temperature estimating unit.Type: ApplicationFiled: September 12, 2011Publication date: January 5, 2012Inventors: Ken YOSHIOKA, Yutaka OMOTO, Mamoru YAKUSHIJI, Tsunehiko TSUBONE, Kazunori NAKAMOTO