Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: An information retrieval translation apparatus for translating a plurality of Chinese terms including a first Chinese term and a second Chinese term is disclosed. The information retrieval oriented translation apparatus includes a first language database, a second language database, a comparison module and a translation term acquisition module. The first language database stores a plurality of first indices and a plurality of corresponding first translation terms. The second language database stores a plurality of second indices and a plurality of corresponding second translation terms. The comparison module compares the first and second Chinese terms with the first and second indices, respectively. The translation term acquisition module acquires the corresponding first translation term for the first index which corresponds to the first Chinese term, and the corresponding second translation term for the second index which corresponds to the second Chinese term.