Patents by Inventor Ken Zhonghua Wu

Ken Zhonghua Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8957516
    Abstract: A low cost and high performance flip chip package is disclosed. By assembling the package using a substrate panel level process, a separate fabrication of a substrate is avoided, thus enabling the use of a coreless substrate. The coreless substrate may include multiple stacked layers of laminate dielectric films having conductive traces and vias. As a result, electrical connection routes may be provided directly from die contact pads to package contact pads without the use of conventional solder bumps, thus accommodating very high density semiconductor dies with small feature sizes. The disclosed flip chip package provides lower cost, higher electrical performance, and improved thermal dissipation compared to conventional fabricated substrates with solder bumped semiconductor dies.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: February 17, 2015
    Assignee: Broadcom Corporation
    Inventors: Mengzhi Pang, Ken Zhonghua Wu, Matthew Kaufmann
  • Publication number: 20140217573
    Abstract: A low cost and high performance flip chip package is disclosed. By assembling the package using a substrate panel level process, a separate fabrication of a substrate is avoided, thus enabling the use of a coreless substrate. The coreless substrate may include multiple stacked layers of laminate dielectric films having conductive traces and vias. As a result, electrical connection routes may be provided directly from die contact pads to package contact pads without the use of conventional solder bumps, thus accommodating very high density semiconductor dies with small feature sizes. The disclosed flip chip package provides lower cost, higher electrical performance, and improved thermal dissipation compared to conventional fabricated substrates with solder bumped semiconductor dies.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Applicant: Broadcom Corporation
    Inventors: Mengzhi PANG, Ken Zhonghua WU, Matthew KAUFMANN
  • Publication number: 20130187284
    Abstract: A low cost and high performance flip chip package is disclosed. By assembling the package using a substrate panel level process, a separate fabrication of a substrate is avoided, thus enabling the use of a coreless substrate. The coreless substrate may include multiple stacked layers of laminate dielectric films having conductive traces and vias. As a result, electrical connection routes may be provided directly from die contact pads to package contact pads without the use of conventional solder bumps, thus accommodating very high density semiconductor dies with small feature sizes. The disclosed flip chip package provides lower cost, higher electrical performance, and improved thermal dissipation compared to conventional fabricated substrates with solder bumped semiconductor dies.
    Type: Application
    Filed: January 24, 2012
    Publication date: July 25, 2013
    Applicant: BROADCOM CORPORATION
    Inventors: Mengzhi Pang, Ken Zhonghua Wu, Matthew Kaufmann