Patents by Inventor Kendra Gallup
Kendra Gallup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7520679Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.Type: GrantFiled: September 19, 2003Date of Patent: April 21, 2009Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.Inventors: Kendra Gallup, Brenton A. Baugh, Robert E. Wilson, James A. Matthews, Christopher L. Coleman, Tanya J. Snyder, James H. Williams
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Patent number: 7358109Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.Type: GrantFiled: November 18, 2004Date of Patent: April 15, 2008Inventors: Kendra Gallup, Brenton A. Baugh, Robert E. Wilson, James A. Matthews, James H. Williams, Tak Kui Wang
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Patent number: 7229217Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.Type: GrantFiled: February 9, 2006Date of Patent: June 12, 2007Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.Inventors: Kendra Gallup, Jim Williams, Edwin Loy, Brent Baugh
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Publication number: 20060133737Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.Type: ApplicationFiled: February 9, 2006Publication date: June 22, 2006Inventors: Kendra Gallup, Jim Williams, Edwin Loy, Brent Baugh
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Publication number: 20060121635Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.Type: ApplicationFiled: January 18, 2006Publication date: June 8, 2006Inventors: Kendra Gallup, James Matthews, Martha Johnson
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Patent number: 7033085Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.Type: GrantFiled: November 29, 2002Date of Patent: April 25, 2006Inventors: Kendra Gallup, Jim Williams, Edwin Loy, Brent Baugh
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Patent number: 6998691Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.Type: GrantFiled: September 19, 2003Date of Patent: February 14, 2006Assignee: Agilent Technologies, Inc.Inventors: Brenton A. Baugh, Tanya J. Snyder, Kendra Gallup
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Publication number: 20060023998Abstract: An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.Type: ApplicationFiled: July 29, 2004Publication date: February 2, 2006Inventors: James Williams, Brenton Baugh, Robert Yi, Robert Wilson, Kendra Gallup
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Patent number: 6982437Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.Type: GrantFiled: September 19, 2003Date of Patent: January 3, 2006Assignee: Agilent Technologies, Inc.Inventors: Kendra Gallup, Brenton A. Baugh, Robert E. Wilson, James A. Matthews, James H. Williams, Tak Kui Wang
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Publication number: 20050285242Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.Type: ApplicationFiled: June 24, 2004Publication date: December 29, 2005Inventors: Kendra Gallup, James Matthews, Martha Johnson
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Publication number: 20050285131Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.Type: ApplicationFiled: March 31, 2005Publication date: December 29, 2005Inventors: Kendra Gallup, James Matthews, Martha Johnson
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Publication number: 20050265722Abstract: An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.Type: ApplicationFiled: July 1, 2005Publication date: December 1, 2005Inventors: Kendra Gallup, James Matthews
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Patent number: 6955934Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.Type: GrantFiled: September 9, 2004Date of Patent: October 18, 2005Assignee: Agilent Technologies, Inc.Inventors: Kendra Gallup, Brenton A. Baugh, Robert E. Wilson, James A. Matthews, James H. Williams
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Patent number: 6955480Abstract: An optoelectronic device is provided having an active alignment. The lens and the optoelectronic device are mounted on their respective carrying members, and the carrying members are placed proximate to each other in a loose alignment controlled by alignment pins loosely engaging oversized alignment opening. An alignment range is created by a difference in the diameter of the alignment pins and the alignment opening, allowing the lens and optoelectronic device to be moved with respect to each other and actively aligned. The member carrying the lens may also include a connector stop cooperatively arranged with the alignment pins to provide an aligned coupling between an optical fiber connector and the optoelectronic component.Type: GrantFiled: June 17, 2002Date of Patent: October 18, 2005Assignee: Agilent Technologies, Inc.Inventors: Kendra Gallup, Frank Flens
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Publication number: 20050142692Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.Type: ApplicationFiled: March 2, 2005Publication date: June 30, 2005Inventors: Kendra Gallup, Frank Geefay, Ronald Fazzio, Martha Johnson, Carrie Guthrie, Tanya Snyder, Richard Ruby
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Patent number: 6900509Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.Type: GrantFiled: September 19, 2003Date of Patent: May 31, 2005Assignee: Agilent Technologies, Inc.Inventors: Kendra Gallup, Brenton A. Baugh, Robert E. Wilson, James A. Matthews, James H. Williams
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Publication number: 20050098790Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.Type: ApplicationFiled: November 18, 2004Publication date: May 12, 2005Inventors: Kendra Gallup, Brenton Baugh, Robert Wilson, James Matthews, James Williams, Tak Wang
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Publication number: 20050062119Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.Type: ApplicationFiled: September 9, 2004Publication date: March 24, 2005Inventors: Kendra Gallup, Brenton Baugh, Robert Wilson, James Matthews, James Williams
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Publication number: 20050063431Abstract: An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.Type: ApplicationFiled: September 19, 2003Publication date: March 24, 2005Inventors: Kendra Gallup, James Matthews
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Publication number: 20050062056Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.Type: ApplicationFiled: September 19, 2003Publication date: March 24, 2005Inventors: Brenton Baugh, Tanya Snyder, Kendra Gallup