Abstract: In the coil component, the lower end portion of the bump electrode protruding from the lower surface of the element body includes a flange portion, and the lower surface of the lower end portion is concave-convex. Therefore, compared to the case where the bump electrode is exposed in the form of a flat surface so as to be flat with the lower surface of the element body, the contact areas between the bump electrodes and the terminal electrodes are increased, and high connection reliability between the bump electrodes and the terminal electrodes is realized.

Abstract: In the coil component, the terminal electrode enters an aperture of the element body and is jointed with the bump electrode inside the element body. That is, the terminal electrode is in contact with both the bump electrode and the element body. Therefore, as compared with the case where the bump electrode is exposed to the lower surface of the element body, a joint surface of the terminal electrode is enlarged, and high adhesion of the terminal electrode is realized.

Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.

Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.

Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.

Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.

Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.