Abstract: A multi-nozzle gas spray arm for a spin coating apparatus. In a typical embodiment, the invention comprises a primary spray arm and a secondary spray arm which is confluently connected to the primary spray arm. The primary spray arm ejects a narrow, relatively high-velocity nitrogen stream against a substrate while the secondary spray arm ejects a diffuse, relatively low-velocity nitrogen stream against the substrate as the gas spray arm is typically swept across the surface of the wafer. The diffuse nitrogen flow characteristic of the nitrogen ejected from the secondary spray arm is effective in eliminating water and chemical droplets which otherwise would tend to remain and form dry spots on the wafer surface.

Abstract: A multi-nozzle gas spray arm for a spin coating apparatus. In a typical embodiment, the invention comprises a primary spray arm and a secondary spray arm which is confluently connected to the primary spray arm. The primary spray arm ejects a narrow, relatively high-velocity nitrogen stream against a substrate while the secondary spray arm ejects a diffuse, relatively low-velocity nitrogen stream against the substrate as the gas spray arm is typically swept across the surface of the wafer. The diffuse nitrogen flow characteristic of the nitrogen ejected from the secondary spray arm is effective in eliminating water and chemical droplets which otherwise would tend to remain and form dry spots on the wafer surface.