Patents by Inventor Keng Chung

Keng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130762
    Abstract: An artificial bone plate unit and an assembleable artificial bone plate are provided. The artificial bone plate unit includes a plate body, multiple connecting pins, connecting holes, drug cavities, and drug-releasing openings. The plate body has two main surfaces and a peripheral surface connected between the two main surfaces. The connecting pins and the connecting holes are formed on the plate body and arranged along the peripheral surface on the plate body. The connecting holes correspond in shape to the connecting pins. The drug cavities are formed in the artificial bone plate unit and are connected to the drug-releasing openings. The artificial bone plate units are connected using the connecting pins and the connecting holes to form the assembleable artificial bone plate. The assembleable artificial bone plate can be bent into the shape of a defect area of the skull, which saves material and time.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Tung-Kuo TSAI, Keng-Liang OU, Yung-Kang SHEN, Yin-Chung HUANG, Kuo-Sheng HUNG, Yu-Sin OU
  • Publication number: 20240136444
    Abstract: A flash memory device and method of making the same are disclosed. The flash memory device is located on a substrate and includes a floating gate electrode, a tunnel dielectric layer located between the substrate and the floating gate electrode, a smaller length control gate electrode and a control gate dielectric layer located between the floating gate electrode and the smaller length control gate electrode. The length of a major axis of the smaller length control gate electrode is less than a length of a major axis of the floating gate electrode.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Inventors: Yu-Chu Lin, Chi-Chung Jen, Wen-Chih Chiang, Yi-Ling Liu, Huai-Jen Tung, Keng-Ying Liao
  • Patent number: 10544369
    Abstract: A process for treating a bitumen froth comprising bitumen, solids and water to produce a deasphalted oil product is provided comprising optionally diluting the raw bitumen froth with a diluent to form a diluted bitumen froth; separating the raw or diluted bitumen froth into a light bitumen fraction and a heavy bitumen fraction comprising bitumen, fine solids and water; mixing the heavy bitumen fraction with a first solvent to form a solvent/bitumen mixture; and introducing the solvent/bitumen mixture into a first extraction vessel operating at a temperature and a pressure such that the solvent is at or near supercritical conditions to form a heavy phase comprising asphaltenes, solids and water and a light phase comprising deasphalted oil.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: January 28, 2020
    Assignee: SYNCRUDE CANADA LTD, in trust for the owners of the Syncrude Project as such owners exist now and in the future
    Inventors: Daniel Bulbuc, Keng Chung, David Childs
  • Patent number: 9629043
    Abstract: A wireless messaging method includes the steps of: when a mobile station is transmitting a message to a network and a first handover occurs, evaluating network conditions to generate an indication signal; and re-transmitting the message according to the indication signal.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: April 18, 2017
    Assignee: MEDIATEK INC.
    Inventors: Keng-Chung Lin, Zong-Ying Tsai
  • Publication number: 20160208174
    Abstract: A process for treating a bitumen froth comprising bitumen, solids and water to produce a deasphalted oil product is provided comprising optionally diluting the raw bitumen froth with a diluent to form a diluted bitumen froth; separating the raw or diluted bitumen froth into a light bitumen fraction and a heavy bitumen fraction comprising bitumen, fine solids and water; mixing the heavy bitumen fraction with a first solvent to form a solvent/bitumen mixture; and introducing the solvent/bitumen mixture into a first extraction vessel operating at a temperature and a pressure such that the solvent is at or near supercritical conditions to form a heavy phase comprising asphaltenes, solids and water and a light phase comprising deasphalted oil.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 21, 2016
    Inventors: DANIEL BULBUC, KENG CHUNG, DAVID CHILDS
  • Publication number: 20150304912
    Abstract: A wireless messaging method includes the steps of: when a mobile station is transmitting a message to a network and a first handover occurs, evaluating network conditions to generate an indication signal; and re-transmitting the message according to the indication signal.
    Type: Application
    Filed: June 30, 2015
    Publication date: October 22, 2015
    Inventors: Keng-Chung Lin, Zong-Ying Tsai
  • Patent number: 9100885
    Abstract: A wireless messaging method includes the steps of: when a mobile station is transmitting a message to a network and a first handover occurs, evaluating network conditions to generate an indication signal; and re-transmitting the message according to the indication signal.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: August 4, 2015
    Assignee: MEDIATEK INC.
    Inventors: Keng-Chung Lin, Zong-Ying Tsai
  • Patent number: 8898892
    Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: December 2, 2014
    Assignee: Tong Hsing Electronic Industries, Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8738081
    Abstract: A communication apparatus is provided. A first subscriber identity card camps on a first cell belonging to a first wireless network via a radio transceiver module and stores first contact entries each having a destination address. A second subscriber identity card camps on a second cell belonging to a second wireless network via the radio transceiver module and stores second contact entries each having a destination address. A processor receives an apparatus originated communication request with a destination address, determines whether the received destination address is currently stored in one of the first contact entries of the first subscriber identity card or one of the second contact entries of the second subscriber identity card, and transmits the apparatus originated communication request to the cell that the determined subscriber identity card camps on to establish a wireless communication with a peer device associated with the received destination address.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: May 27, 2014
    Assignee: Mediatek Inc.
    Inventors: Yu-Syuan Jheng, Keng-Chung Lin
  • Publication number: 20140000106
    Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
    Type: Application
    Filed: September 5, 2013
    Publication date: January 2, 2014
    Applicant: Tong Hsing Electronic Industries, Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8549739
    Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Tong Hsing Electronic Industries, Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8461614
    Abstract: A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: June 11, 2013
    Assignee: Tong Hsing Electronic Industries, Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8431835
    Abstract: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: April 30, 2013
    Assignee: High Conduction Scientific Co. Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8213989
    Abstract: A method for transmitting mobile originated requests by a mobile station with a first subscriber identity card and a second subscriber identity card, executed by a processor, is provided. It is determined whether a preference setting has been enabled. A preferred subscriber identity card is obtained from the first subscriber identity card and the second subscriber identity card when the preference setting has been enabled. The mobile originated request is issued to a called party via the preferred subscriber identity card when the preference setting has been enabled.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: July 3, 2012
    Assignee: Mediatek Inc.
    Inventors: Yu-Syuan Jheng, Keng-Chung Lin, Chun-Ying Wu
  • Publication number: 20120094678
    Abstract: A communication apparatus is provided. A first subscriber identity card camps on a first cell belonging to a first wireless network via a radio transceiver module and stores first contact entries each having a destination address. A second subscriber identity card camps on a second cell belonging to a second wireless network via the radio transceiver module and stores second contact entries each having a destination address. A processor receives an apparatus originated communication request with a destination address, determines whether the received destination address is currently stored in one of the first contact entries of the first subscriber identity card or one of the second contact entries of the second subscriber identity card, and transmits the apparatus originated communication request to the cell that the determined subscriber identity card camps on to establish a wireless communication with a peer device associated with the received destination address.
    Type: Application
    Filed: December 30, 2011
    Publication date: April 19, 2012
    Applicant: MEDIATEK INC.
    Inventors: Yu-Syuan Jheng, Keng-Chung Lin
  • Patent number: 8112117
    Abstract: A communication apparatus is provided. A first subscriber identity card camps on a first cell belonging to a first wireless network via a radio transceiver module and stores first contact entries each having a destination address. A second subscriber identity card camps on a second cell belonging to a second wireless network via the radio transceiver module and stores second contact entries each having a destination address. A processor receives an apparatus originated communication request with a destination address, determines whether the received destination address is currently stored in one of the first contact entries of the first subscriber identity card or one of the second contact entries of the second subscriber identity card, and transmits the apparatus originated communication request to the cell that the determined subscriber identity card camps on to establish a wireless communication with a peer device associated with the received destination address.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: February 7, 2012
    Assignee: Mediatek Inc.
    Inventors: Yu-Syuan Jheng, Keng-Chung Lin
  • Patent number: 8108002
    Abstract: A communication apparatus is provided. The communication apparatus includes at least one radio transceiver module, a first subscriber identity card, a second subscriber identity card and a processor. The first subscriber identity card camps on a first cell belonging to a first wireless network via the same or different radio transceiver modules. The second subscriber identity card camps on a second cell belonging to a second wireless network via the same or different radio transceiver modules. The processor, coupled to the first subscriber identity card, the second subscriber identity card and the radio transceiver module(s), receives an apparatus originated communication request with a destination address, compares a signal strength of a first signal received from the first cell with a signal strength of a second signal received from the second cell and establishes a wireless communication with a peer device having the destination address through the cell with better signal strength.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: January 31, 2012
    Assignee: Mediatek Inc.
    Inventor: Keng-Chung Lin
  • Publication number: 20110171959
    Abstract: A wireless messaging method includes the steps of: when a mobile station is transmitting a message to a network and a first handover occurs, evaluating network conditions to generate an indication signal; and re-transmitting the message according to the indication signal.
    Type: Application
    Filed: January 11, 2010
    Publication date: July 14, 2011
    Inventors: Keng-Chung Lin, Zong-Ying Tsai
  • Publication number: 20100288537
    Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
    Type: Application
    Filed: May 13, 2010
    Publication date: November 18, 2010
    Applicant: High Conduction Scientific Co., Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Publication number: 20100258838
    Abstract: A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.
    Type: Application
    Filed: April 2, 2010
    Publication date: October 14, 2010
    Applicant: High Conduction Scientific Co., Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu