Patents by Inventor Keng-Hong Lin

Keng-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060237320
    Abstract: A method for forming a metal layer having a predetermined thickness on an underlying material is disclosed. According to the method, the underlying material is electroplated to form the metal layer having a fraction of the predetermined thickness thereon. The step of electroplating is interrupted for a predetermined period of time. The step of electroplating is then resumed to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.
    Type: Application
    Filed: April 25, 2005
    Publication date: October 26, 2006
    Inventors: K.Y. Lin, Chuan-Ping Hou, Keng-Hong Lin, Po-Jen Shih, S.K. Chen, Chao-Lung Chen, Chen Cheng Chou, Chyi Chern, De-Dui Liao