Patents by Inventor Keng-Hong Lin

Keng-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250064345
    Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 27, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Je-Ping Hu, Keng-Hsun Lin, Shih-Fang Yang Mao, Pin-Chou Li, Jian-Hong Wu, Szu-Ju Li, Hui-Yu Cho, Yu-Chang Chen, Yen-Nien Lu, Jyun-Siang Hsu, Nien-Ya Lee, Kuan-Ting Ho, Ming-Chieh Tsai, Ching-Yu Huang
  • Publication number: 20060237320
    Abstract: A method for forming a metal layer having a predetermined thickness on an underlying material is disclosed. According to the method, the underlying material is electroplated to form the metal layer having a fraction of the predetermined thickness thereon. The step of electroplating is interrupted for a predetermined period of time. The step of electroplating is then resumed to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.
    Type: Application
    Filed: April 25, 2005
    Publication date: October 26, 2006
    Inventors: K.Y. Lin, Chuan-Ping Hou, Keng-Hong Lin, Po-Jen Shih, S.K. Chen, Chao-Lung Chen, Chen Cheng Chou, Chyi Chern, De-Dui Liao