Patents by Inventor Keng Hung Lin

Keng Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11011413
    Abstract: Embodiments described herein relate generally to one or more methods for forming an interconnect structure, such as a dual damascene interconnect structure comprising a conductive line and a conductive via, and structures formed thereby. In some embodiments, an interconnect opening is formed through one or more dielectric layers over a semiconductor substrate. The interconnect opening has a via opening and a trench over the via opening. A conductive via is formed in the via opening. A nucleation enhancement treatment is performed on one or more exposed dielectric surfaces of the trench. A conductive line is formed in the trench on the one or more exposed dielectric surfaces of the trench and on the conductive via.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: May 18, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Li Wang, Shuen-Shin Liang, Jung-Hao Chang, Chia-Hung Chu, Keng-Chu Lin
  • Publication number: 20200273838
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Application
    Filed: April 6, 2020
    Publication date: August 27, 2020
    Inventors: Richard K. Williams, Keng Hung Lin
  • Patent number: 10615146
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Grant
    Filed: July 21, 2018
    Date of Patent: April 7, 2020
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Publication number: 20190373687
    Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 5, 2019
    Applicant: Applied BioPhotonics Ltd.
    Inventors: Richard K. Williams, Keng Hung Lin, Daniel Schell, Joseph P. Leahy
  • Publication number: 20190335551
    Abstract: In a photobiomodulation therapy (PBT) process, defined patterns (e.g., sequences of square-wave pulses, sine waves, or combinations thereof) of electromagnetic radiation (EMR) having one or more wavelengths, or spectral bands of wavelengths, are introduced into a living organism (e.g. a human being or animal) using a distributed system comprising two or more distributed components or “nodes” communicating using a bus or transceiver to send instructions or files between or among the constituent components. The distributed PBT system prevents intentional usurpation of system control (hacking), thwarts unauthorized monitoring of data (surveillance), and reduces the likelihood and severity of accidental system malfunction arising from corrupted command and control packets or ambient EMI.
    Type: Application
    Filed: April 6, 2019
    Publication date: October 31, 2019
    Inventors: Richard K. Williams, Keng-Hung Lin, Laura E. Williams
  • Publication number: 20190246463
    Abstract: A phototherapy system includes a channel driver, a first microcontroller and a pad comprising a string of light-emitting diodes (LEDs). The pad also comprises a second microcontroller that autonomously controls the string of LEDs such that the LEDs are controlled even if communication between the first microcontroller and the pad is interrupted.
    Type: Application
    Filed: April 6, 2019
    Publication date: August 8, 2019
    Inventors: Richard K. Williams, Keng-Hung Lin, Laura E. Williams
  • Patent number: 10328276
    Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally, in accordance with a square-wave function. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: June 25, 2019
    Assignee: Applied BioPhotonics Ltd.
    Inventors: Richard K. Williams, Keng Hung Lin, Daniel Schell, Joseph P. Leahy
  • Patent number: 10312111
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 4, 2019
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180343741
    Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
    Type: Application
    Filed: August 5, 2018
    Publication date: November 29, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180331067
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Application
    Filed: July 21, 2018
    Publication date: November 15, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Publication number: 20180330968
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Application
    Filed: July 20, 2018
    Publication date: November 15, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Patent number: 10064276
    Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: August 28, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K Williams, Keng Hung Lin
  • Patent number: 10032744
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: July 24, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Patent number: 10032649
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 24, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180169431
    Abstract: In a flexible LED pad for use in phototherapy treatment of humans or animals, the PCBs in the pad are securely linked together with electrical connectors and ribbon cables to prevent the connections from being broken as the flexible pad is bent or otherwise deformed during the treatment. In one embodiment, low-profile socket connectors are mounted to the PCBs and mate with plug connectors at the ends of the ribbon cables. For similar reasons, the LED pad may be connected to an LED control unit by means of an electrical connector (e.g. a USB socket) mounted to a PCB in the LED pad. The PCBs, on which the LEDs are mounted, are fitted into a downset in the flexible pad to prevent the LEDs from becoming misaligned with openings in the flexible pad.
    Type: Application
    Filed: February 11, 2018
    Publication date: June 21, 2018
    Applicant: Applied BioPhotonics Ltd
    Inventors: Richard K. Williams, Keng Hung Lin, Yu-Min Lin, Daniel Schell, Joseph Leahy
  • Patent number: 9895550
    Abstract: In a flexible LED pad for use in phototherapy treatment of humans or animals, the PCBs in the pad are securely linked together with electrical connectors and ribbon cables to prevent the connections from being broken as the flexible pad is bent or otherwise deformed during the treatment. In one embodiment, low-profile socket connectors are mounted to the PCBs and mate with plug connectors at the ends of the ribbon cables. For similar reasons, the LED pad may be connected to an LED control unit by means of an electrical connector (e.g. a USB socket) mounted to a PCB in the LED pad. The PCBs, on which the LEDs are mounted, are fitted into a downset in the flexible pad to prevent the LEDs from becoming misaligned with openings in the flexible pad.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: February 20, 2018
    Assignee: Applied BioPhotonics Ltd
    Inventors: Richard K. Williams, Keng Hung Lin, Yu-Min Lin, Daniel Schell, Joseph Leahy
  • Publication number: 20170178928
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Application
    Filed: March 8, 2017
    Publication date: June 22, 2017
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20170170144
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Application
    Filed: January 25, 2017
    Publication date: June 15, 2017
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Publication number: 20170118838
    Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 27, 2017
    Applicant: ADVENTIVE IPBANK
    Inventors: Richard K. Williams, Keng Hung Lin
  • Patent number: 9620439
    Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: April 11, 2017
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin