Patents by Inventor Keng Lau

Keng Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230084781
    Abstract: Exemplary embodiments of the present disclosure can provide for a transparent panel that can have a featured image which can be surrounded by a pattern of repeating designs on a first side of the panel. A vinyl layer can be provided on the entire first side of the panel to assist in the featured image and repeating designs to be viewable on the second side of the panel (opposite of the first side). On the second opposite side of the panel, an area of the panel where the pattern of designs is visible is provided with a series of lens that can overly the repeating designs. In some exemplary embodiments, the lenses can project enlarged representations of the underlying repeating designs that appear to the eye as occupying a different plane than the featured image, creating a sense of depth within the image.
    Type: Application
    Filed: July 21, 2022
    Publication date: March 16, 2023
    Inventors: David Schwartz, Keng Lau
  • Patent number: 7543189
    Abstract: A computer system and method tests various language installations of an application program using a single test script. The various language translations existing with the application program are used to provide translations of test command strings from one language to the specific language of the application program (operating system locale for executing the program). The test script may then be translated at runtime using the predefined program-established translations to allow the testing program to test the application program in accordance with the language of the application program/operating system locale.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: June 2, 2009
    Assignee: International Business Machines Corporation
    Inventors: George M. Fichter, Mikhail I. Kliorin, Ban Keng Lau
  • Publication number: 20060249830
    Abstract: A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the leadframe. The interposer is insulated from the leads. A die is attached to the interposer.
    Type: Application
    Filed: May 9, 2005
    Publication date: November 9, 2006
    Applicant: STATS ChipPAC Ltd.
    Inventors: Il Shim, Jeffrey Punzalan, Keng Lau
  • Publication number: 20060234426
    Abstract: A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads outwardly when an encapsulant flows therepast.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventor: Keng LAU
  • Patent number: 6505928
    Abstract: Apparatus and methods for applying drying air to a printed substrate during each pass of a print head over the substrate. Preferred embodiments of the present invention direct heated air onto the printed substrate and then draw that heated air away from the proximity of the substrate with a vacuum.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: January 14, 2003
    Assignee: Digital Printing Systems, LLC
    Inventors: Arthur Landau, Clement Onyenemezu, Keng Lau