Patents by Inventor Keng Lin

Keng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210157445
    Abstract: A capacitive touch screen, having a first transparent substrate provided with a touch circuit layer. The touch circuit layer is provided with first and second electrodes and a jumper portion. The touch screen is further provided with an insulating layer. The insulating layer is continuously disposed in an entire transparent touch area of the touch screen, and is provided with through holes at the jumper portion to form a jumper connection of the second electrode. The touch screen further includes a shielding layer sandwiched between the first transparent substrate and the touch circuit layer, and contains multiple shielding blocks. The shielding blocks correspond to the through holes, and the contours of the shielding blocks are formed by expanding the contours of the through holes outwards. The capacitive touch screen can effectively reduce side light reflection on an edge slope of the insulating layer, thereby avoiding interference with display.
    Type: Application
    Filed: May 23, 2018
    Publication date: May 27, 2021
    Inventors: MIN LIN, Xichun WU, Yi SHEN, Yinghuang SUN, Keng LIN, Yuemin LV, Yuanming CHEN, Dezhi LIN, Jiatong GAO, Yongbin HUANG, Yan WANG, Dingji CHEN
  • Patent number: 11016621
    Abstract: A capacitive touch screen, having a first transparent substrate provided with a touch circuit layer. The touch circuit layer is provided with first and second electrodes and a jumper portion. The touch screen is further provided with an insulating layer. The insulating layer is continuously disposed in an entire transparent touch area of the touch screen, and is provided with through holes at the jumper portion to form a jumper connection of the second electrode. The touch screen further includes a shielding layer sandwiched between the first transparent substrate and the touch circuit layer, and contains multiple shielding blocks. The shielding blocks correspond to the through holes, and the contours of the shielding blocks are formed by expanding the contours of the through holes outwards. The capacitive touch screen can effectively reduce side light reflection on an edge slope of the insulating layer, thereby avoiding interference with display.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: May 25, 2021
    Inventors: Min Lin, Xichun Wu, Yi Shen, Yinghuang Sun, Keng Lin, Yuemin Lv, Yuanming Chen, Dezhi Lin, Jiatong Gao, Yongbin Huang, Yan Wang, Dingji Chen
  • Publication number: 20190283205
    Abstract: The present invention provides a polishing roll capable of, for example, realizing three-dimensional polishing of hard materials such as sapphire glass at a high removal amount. The polishing roll is a cylindrical polishing roll capable of rotating about a central axis, characterized in that the polishing roll includes a core part serving as a central axis to which torque is applied, an intermediate part having a cross-section concentric with the core part, and a polishing part disposed on the outer peripheral surface of the intermediate part, and the intermediate part is made of a cushion material that is softer than the polishing part.
    Type: Application
    Filed: October 30, 2017
    Publication date: September 19, 2019
    Applicant: NITTA HAAS INCORPORATED
    Inventors: Yoshitaka MORIOKA, Kazunori ITO, Keng LIN, Jia-Wen TSAI
  • Publication number: 20080017966
    Abstract: A semiconductor product includes a die and leadframe included in a package made of plastic or other insulating material. The die and leadframe are dimensioned so that they overlap in at least one location. One or more pillar bumps, formed from as a cylindrical conductive base topped with a solder bump are used to interconnect the leadframe and die in the region of overlap. The pillar bumps perform several purposes including: electrical connection between the leadframe and die, support for the die during packaging and conduction of heat away from the die.
    Type: Application
    Filed: April 3, 2007
    Publication date: January 24, 2008
    Applicant: ADVANCED ANALOGIC TECHNOLOGIES, INC.
    Inventors: Richard Williams, Allen Lam, Keng Lin