Patents by Inventor Keng-Ming Lai

Keng-Ming Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for maximizing uplink bandwidth in a communication system
    Patent number: 11917230
    Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Quanta Cloud Technology Inc.
    Inventors: Yi-Neng Zeng, Keng-Cheng Liu, Wei-Ming Huang, Shih-Hsun Lai, Ji-Jeng Lin, Chia-Jui Lee, Liao Jin Xiang
  • Electronic bonding structure with separately distributed anisotropic conductive film units and liquid crystal panel having same
    Patent number: 7515238
    Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: April 7, 2009
    Assignee: Innolux Display Corp.
    Inventors: Kuan-Hsin Chen, Keng-Ming Lai, Chih-Hung Hsiao, Min-Cheng Wang
  • Electronic bonding structure with separately distributed anisotropic conductive film units and liquid crystal panel having same
    Publication number: 20070052905
    Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.
    Type: Application
    Filed: September 6, 2006
    Publication date: March 8, 2007
    Inventors: Kuan-Hsin Chen, Keng-Ming Lai, Chih-Hung Hsiao, Min-Cheng Wang