Patents by Inventor Keng Teo

Keng Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for soldering modules to substrates
    Publication number: 20060249855
    Abstract: A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the module. The module is then positioned on the substrate so that the array of solder blocks contacts the array of contact pads on the substrate. Heat is then applied to reflow the solder blocks to provide mechanical and electrical connection of the module to the substrate.
    Type: Application
    Filed: July 7, 2006
    Publication date: November 9, 2006
    Inventors: Keng Teo, Wey Ngee Chin