Patents by Inventor Keng Yew James Song
Keng Yew James Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8707550Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.Type: GrantFiled: July 24, 2009Date of Patent: April 29, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
-
Patent number: 8459530Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.Type: GrantFiled: October 29, 2009Date of Patent: June 11, 2013Assignee: ASM Technology Singapore Pte LtdInventors: Yue Zhang, Keng Yew James Song, Xiao Liang Chen
-
Publication number: 20120145770Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.Type: ApplicationFiled: December 14, 2010Publication date: June 14, 2012Inventors: Keng Yew James SONG, Ka Shing Kenny KWAN, Boon June YEAP, Shi Jie CHEN, Sathish Kumar BALAKRISHNAN, Kumaresh GOVINDAN RADHAKRISHNAN
-
Publication number: 20120132695Abstract: A wire bonder comprises a bonding tool for forming wire bonds and a pneumatic device for feeding wire to the bonding tool. An upper clamp and a lower clamp are aligned along a wire feeding route between the pneumatic device and the bonding tool to clamp the wire at respective clamping points. A fixed intermediate guiding chamber extends substantially from the upper clamp to the lower clamp. The said intermediate guiding chamber encloses the wire along the wire feeding route and is operative to shield and guide the wire.Type: ApplicationFiled: November 30, 2010Publication date: May 31, 2012Inventors: Yue ZHANG, Xiao Liang CHEN, Keng Yew James SONG
-
Patent number: 8186562Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.Type: GrantFiled: December 14, 2010Date of Patent: May 29, 2012Assignee: ASM Technology Singapore PTE LtdInventors: Keng Yew James Song, Ka Shing Kenny Kwan, Boon June Yeap, Shi Jie Chen, Sathish Kumar Balakrishnan, Kumaresh Govindan Radhakrishnan
-
Publication number: 20110101073Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.Type: ApplicationFiled: October 29, 2009Publication date: May 5, 2011Inventors: Yue ZHANG, Keng Yew James SONG, Xiao Liang CHEN
-
Publication number: 20110016707Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.Type: ApplicationFiled: July 24, 2009Publication date: January 27, 2011Inventors: Keng Yew James SONG, Ka Shing Kenny KWAN, Choong Kead Leslie LUM, Ting Yu HE
-
Patent number: 7677431Abstract: A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.Type: GrantFiled: August 22, 2007Date of Patent: March 16, 2010Assignee: ASM Technology Singapore Pte Ltd.Inventors: Yam Mo Wong, Keng Yew James Song, Ka Shing Kenny Kwan
-
Patent number: 7568606Abstract: A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.Type: GrantFiled: October 19, 2006Date of Patent: August 4, 2009Assignee: ASM Technology Singapore Pte Ltd.Inventors: Yam Mo Wong, Keng Yew James Song, Ka Shing Kenny Kwan
-
Publication number: 20080092370Abstract: A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.Type: ApplicationFiled: October 19, 2006Publication date: April 24, 2008Inventors: Yam Mo WONG, Keng Yew James SONG, Ka Shing Kenny KWAN
-
Publication number: 20080093004Abstract: A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.Type: ApplicationFiled: August 22, 2007Publication date: April 24, 2008Inventors: Yam Mo WONG, Keng Yew James SONG, Ka Shing Kenny KWAN
-
Publication number: 20080073408Abstract: A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position.Type: ApplicationFiled: September 22, 2006Publication date: March 27, 2008Inventors: Ka Shing Kenny KWAN, Chong Hao CHEN, Gang OU, Keng Yew James SONG