Abstract: A flip chip semiconductor package is proposed, in which a dam structure is formed of an adhesive compound such as epoxy resin on a substrate around a chip. The adhesive compound has a larger coefficient of thermal expansion than that of the substrate, and generates a greater thermal contraction force for counteracting thermal stress of the substrate in a cooling process in fabrication, so as to maintain planarity and structural intactness of the substrate and chip. Moreover, the chip can be made in a manner as to expose a non-active surface thereof to the atmosphere for facilitating dissipation of heat generated by the chip, while a heat sink can be additionally disposed on the chip, so as to further improve heat dissipating efficiency of the semiconductor package.

Abstract: A flip chip semiconductor package is proposed, in which a dam structure is formed of an adhesive compound such as epoxy resin on a substrate around a chip. The adhesive compound has a larger coefficient of thermal expansion than that of the substrate, and generates a greater thermal contraction force for counteracting thermal stress of the substrate in a cooling process in fabrication, so as to maintain planarity and structural intactness of the substrate and chip. Moreover, the chip can be made in a manner as to expose a non-active surface thereof to the atmosphere for facilitating dissipation of heat generated by the chip, while a heat sink can be additionally disposed on the chip, so as to further improve heat dissipating efficiency of the semiconductor package.