Abstract: A dielectric composition, including: dielectric grains containing a main component represented by a composition formula [(CaxSr(1-x))O]m[(TiyHfzZr(1-y-z))O2] (m is more than 1.020); a grain boundary phase located between the dielectric grains; and segregation grains each containing at least Ca, Si, and O. A first segregation grain is defined as a segregation further containing Mn among the segregation grains each containing at least Ca, Si, and O, and a second segregation grain is defined as a segregation containing substantially no Mn among the segregation grains each containing at least Ca, Si, and O. N1/(N1+N2) is more than 0.23 and 1.00 or less, in which N1 is a number density of first segregation grains in a cross-section of the dielectric composition, and N2 is a number density of second segregation grains in the cross-section of the dielectric composition.

Abstract: There is provided an additive processing device that models a workpiece by melting a supplied powder material and forming layers of the melted powder material. The additive processing device is provided with a laser head configured to supply the powder material to the workpiece and irradiate the workpiece with a laser beam, a drive unit configured to drive the laser head, a recognition unit configured to recognize a height of the workpiece in a laminating direction while the laser head is forming an N-th layer (N being a natural number) of the workpiece, a generation unit configured to generate a drive path for the laser head for formation of an N+1-th layer of the workpiece, based on the recognized height, and a control unit configured to control the drive unit based on the drive path.