Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Abstract: A heat processing device includes a hot plate on which a substrate is placed, a heater press-fitted in the hot plate for heating the substrate through the hot plate, and a reflecting plate facing an underside and side faces of the hot plate at a distance therefrom for reflecting heat radiated from the hot plate. An outside frame is arranged on the surface of the hot plate so as to surround the substrate.

Abstract: This invention relates to a processing apparatus having an object holding means for holding an object to be processed, a processing chamber for housing the object to be processed and the object holding means, an ultraviolet irradiation means for irradiating ultraviolet rays on the object to be processed, an ultraviolet irradiation means chamber incorporating the ultraviolet irradiation means, an opening/closing means for opening/closing an opening for allowing the processing chamber to communicate with the ultraviolet irradiation means chamber, a first exhaust means for exhausting ozone which is produced upon irradiation of the ultraviolet ray by the ultraviolet irradiation means and present in the processing chamber, and a second exhaust means for exhausting ozone produced in the ultraviolet irradiation means chamber, and a processing method using the same.

Abstract: A processing apparatus comprises a carrier rest portion for placing thereon carriers each of which stores a plurality of plate-like target bodies substantially horizontally with gaps therebetween in the vertical direction and which has a front surface forming a target body transfer port and a side surface having a light-transmitting portion, a convey mechanism having a target body holding member which is movable back and forth and movable vertically relative to the carrier rest portion to sequentially extract and transfer target bodies in the carrier to a processing unit, and photocoupler and a mirror, provided to the convey mechanism to oppose each other through part of the target body in the horizontal direction, for detecting presence/absence of a target body in each stage of the carrier on the carrier rest portion.

Abstract: A substrate scrubbing and cleaning method in which a substrate is carried to a rotatable scrubbing arrangement, and both surfaces of the substrate are scrubbed by the rotatable scrubbing arrangement while the substrate is maintained substantially horizontal. In addition, a cleaning solution is applied to both surfaces of the substrate while the substrate is substantially horizontal and is linearly reciprocated.

Abstract: A substrate scrubbing and cleaning device comprising a mechanism having an upper and a lower brush members for scrubbing both surfaces of an LCD glass substrate, a mechanism for rotating the upper and lower brush members, a mechanism for supplying pure water to the upper and lower brush members, a mechanism for carrying the substrate between the upper and the lower brush members to reciprocate it relative to the upper and lower brush members in a substrate carrying direction, and a controller for controlling the operation of the substrate carrying mechanism.