Patents by Inventor Kengo Morioka
Kengo Morioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10471266Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.Type: GrantFiled: July 12, 2016Date of Patent: November 12, 2019Assignees: MEDTRONIC, INC., KYOCERA CORPORATIONInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 10247620Abstract: A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.Type: GrantFiled: April 20, 2015Date of Patent: April 2, 2019Assignee: KYOCERA CORPORATIONInventors: Hiroshi Matsumoto, Kengo Morioka, Takahito Hirata
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Publication number: 20170219439Abstract: A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.Type: ApplicationFiled: April 20, 2015Publication date: August 3, 2017Applicant: KYOCERA CorporationInventors: Hiroshi MATSUMOTO, Kengo MORIOKA, Takahito HIRATA
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Publication number: 20160317821Abstract: A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.Type: ApplicationFiled: July 12, 2016Publication date: November 3, 2016Applicants: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 9418778Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.Type: GrantFiled: March 10, 2014Date of Patent: August 16, 2016Assignees: MEDTRONIC, INC., KYOCERA CORPORATIONInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 9008779Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.Type: GrantFiled: February 7, 2014Date of Patent: April 14, 2015Assignees: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 8872035Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.Type: GrantFiled: August 1, 2012Date of Patent: October 28, 2014Assignees: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
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Publication number: 20140305694Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.Type: ApplicationFiled: March 10, 2014Publication date: October 16, 2014Applicants: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 8841558Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.Type: GrantFiled: August 2, 2011Date of Patent: September 23, 2014Assignees: Medtronic Inc., Kyocera CorporationInventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Publication number: 20140151114Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.Type: ApplicationFiled: February 7, 2014Publication date: June 5, 2014Applicants: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 8670829Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.Type: GrantFiled: August 2, 2011Date of Patent: March 11, 2014Assignees: Medtronic, Inc., Kyocera CorporationInventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Patent number: 8588916Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.Type: GrantFiled: August 2, 2011Date of Patent: November 19, 2013Assignee: Medtronic, Inc.Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Publication number: 20130032382Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.Type: ApplicationFiled: August 2, 2011Publication date: February 7, 2013Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Publication number: 20130032378Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.Type: ApplicationFiled: August 1, 2012Publication date: February 7, 2013Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
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Publication number: 20130032392Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.Type: ApplicationFiled: August 2, 2011Publication date: February 7, 2013Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
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Publication number: 20130032391Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.Type: ApplicationFiled: August 2, 2011Publication date: February 7, 2013Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto