Patents by Inventor Kengo NISHIUMI

Kengo NISHIUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958922
    Abstract: The present invention provides vinyl-based resin particles capable of easily smoothing the surface of a thermosetting resin film when the particles are used as a pore-forming material for a thermosetting resin. Specifically, the present invention provides vinyl-based resin particles for use in making a thermosetting resin porous, the particles having a temperature of 230° C. or higher and lower than 300° C. at 10% mass loss when heated at a rate of 10° C./min in an air atmosphere, and the particles having a mass loss percentage of 85 to 100% after being heated at 350° C. for 5 hours in an air atmosphere.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 16, 2024
    Assignee: SEKISUI PLASTICS CO., LTD.
    Inventors: Kohei Tanaka, Kengo Nishiumi, Ryosuke Harada
  • Publication number: 20220356326
    Abstract: Biodegradable resin particles including a polyhydroxy alkanoate. In the biodegradable resin particles, an amount of a Ca component present in the particles is 10 to 10,000 ppm, the biodegradable resin particles have a volume average particle diameter of 2 to 50 ?m, the biodegradable resin particles have a BET specific surface area of 0.8 to 10 m2/g, and the biodegradable resin particles have a linseed oil absorption of 50 to 300 ml/100 g. The resin particles of the present invention can be suitably used by being included in an external preparation, such as a cosmetic or a quasi-drug.
    Type: Application
    Filed: June 25, 2020
    Publication date: November 10, 2022
    Applicant: SEKISUI KASEI CO., LTD.
    Inventors: Kengo NISHIUMI, Shinya MATSUNO
  • Publication number: 20220153996
    Abstract: Biodegradable resin particles including a recessed portion in a surface of the particles; and a hollow portion within the particles. The biodegradable resin particles of the present invention can be used in external preparations, such as cosmetics and quasi-drugs; coating materials, such as powder coating compositions and matting agents for coating compositions; rheology modifying agents; anti-blocking agents; smoothing agents; light-diffusing agents; additives for advanced ceramics sintering; fillers for adhesives; and agents for medical diagnosis and examination and can also be used by being added to a resin composition for automotive materials, construction materials, or the like or to a molded product thereof.
    Type: Application
    Filed: March 12, 2020
    Publication date: May 19, 2022
    Applicant: SEKISUI KASEI CO., LTD.
    Inventors: Takashi MOTOMURA, Kengo NISHIUMI
  • Publication number: 20210347923
    Abstract: The present invention provides vinyl-based resin particles capable of easily smoothing the surface of a thermosetting resin film when the particles are used as a pore-forming material for a thermosetting resin. Specifically, the present invention provides vinyl-based resin particles for use in making a thermosetting resin porous, the particles having a temperature of 230° C. or higher and lower than 300° C. at 10% mass loss when heated at a rate of 10° C./min in an air atmosphere, and the particles having a mass loss percentage of 85 to 100% after being heated at 350° C. for 5 hours in an air atmosphere.
    Type: Application
    Filed: August 28, 2019
    Publication date: November 11, 2021
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Kohei TANAKA, Kengo NISHIUMI, Ryosuke HARADA
  • Patent number: 11060007
    Abstract: Organic-inorganic composite particles include: a vinyl polymer that is a polymer of a polymerizable vinyl monomer; and inorganic particles including inorganic oxide and/or inorganic nitride. The thermal conductivity of the inorganic particles is 10 W/(m·K) or more. The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound selected from the group consisting of: carboxylic acid having a polymerizable functional group; acidic phosphoric acid ester having a polymerizable functional group; and lactone having a polymerizable functional group. The polymerizable compound is bonded to the vinyl polymer, and the inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: July 13, 2021
    Assignee: SEKISUI KASEI CO., LTD.
    Inventor: Kengo Nishiumi
  • Publication number: 20200399413
    Abstract: The present invention provides vinyl-based resin particles capable of forming uniform pores in a thermosetting resin film when the particles are used as a pore-forming material for a thermosetting resin. Specifically, the present invention provides vinyl-based resin particles for use in making a thermosetting resin porous, the particles having a temperature of 300 to 350° C. at 10% mass loss when heated at a rate of 10° C./min in an air atmosphere, and the particles having a mass loss percentage of 85 to 100% after being heated at 350° C. for 5 hours in an air atmosphere.
    Type: Application
    Filed: March 22, 2019
    Publication date: December 24, 2020
    Applicant: SEKISUI KASEI CO., LTD.
    Inventors: Kengo NISHIUMI, Ryosuke HARADA
  • Patent number: 10550280
    Abstract: Provided are hollow particles each having a shell including at least one layer, wherein the hollow particles have an average particle diameter of 10 to 200 nm and the at least one layer contains a vinyl-based resin.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: February 4, 2020
    Assignee: SEKISUI PLASTICS CO., LTD.
    Inventors: Yugo Katayama, Kengo Nishiumi, Ayumi Kiyohara, Shuichi Sasahara, Haruhiko Matsuura, Junko Kubo
  • Publication number: 20200032122
    Abstract: Organic-inorganic composite particles include: a vinyl polymer that is a polymer of a polymerizable vinyl monomer; and inorganic particles including inorganic oxide and/or inorganic nitride. The thermal conductivity of the inorganic particles is 10 W/(m·K) or more. The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound selected from the group consisting of: carboxylic acid having a polymerizable functional group; acidic phosphoric acid ester having a polymerizable functional group; and lactone having a polymerizable functional group. The polymerizable compound is bonded to the vinyl polymer, and the inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers.
    Type: Application
    Filed: March 30, 2018
    Publication date: January 30, 2020
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventor: Kengo NISHIUMI
  • Publication number: 20180319126
    Abstract: An expandable panel reinforcing material, including an expandable composition layer including at least a plastic component of a crosslinked polymer matrix having curability, a curing agent of the plastic component, a curing accelerator of the plastic component, a crosslinked polymer matrix, a filler, and a thermally decomposable blowing agent having a decomposition temperature of T° C., and a sheet-like fiber layer that is laminated on the expandable composition layer, in which the expandable composition layer exhibits a storage elastic modulus (G?) of 1×101 to 1×104 Pa when the storage elastic modulus (G?) is measured with a dynamic viscoelasticity measuring apparatus [provided that a measuring temperature is (T?10)° C.].
    Type: Application
    Filed: November 22, 2016
    Publication date: November 8, 2018
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Koichiro OKAMOTO, Kengo NISHIUMI, Shuichi SASAHARA
  • Publication number: 20180215956
    Abstract: A metal panel reinforcing material comprising a resin composition, including a plastic component that has at least curability and is for a crosslinked polymer matrix, a curing agent for the plastic component, a curing accelerator for the plastic component, and a crosslinked polymer matrix, and a sheet-like fiber substrate, in which when the metal panel reinforcing material is stuck to a metal panel having a thickness of 0.8 mm and heated to be integrated into a reinforced metal panel, the metal panel reinforcing material exhibits the following properties to said metal panel: in three-point bending measured at a span of 100 mm, (i) a strength improvement rate of strength at 1 mm displacement is 120% or more, (ii) a maximum strength improvement rate is 200% or more, and (iii) a strain energy up to a maximum point is 0.5 N·m or more.
    Type: Application
    Filed: August 18, 2016
    Publication date: August 2, 2018
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Koichiro OKAMOTO, Kengo NISHIUMI, Shuichi SASAHARA
  • Publication number: 20180163004
    Abstract: A hydrogel comprising water, a gel strength improving agent, and a polymer matrix containing the water and the gel strength improving agent, in which the polymer matrix includes a copolymer of a monofunctional monomer having one ethylenically unsaturated group and a polyfunctional monomer having 2 to 6 ethylenically unsaturated groups, the copolymer has a hydrophilic group binding to its main chain, and the hydrogel has a breaking strength of 5 kPa or more and a breaking elongation of 200% or more in a tensile test.
    Type: Application
    Filed: September 9, 2016
    Publication date: June 14, 2018
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Kengo NISHIUMI, Ryo AKUTA, Koichiro OKAMOTO, Shuichi SASAHARA
  • Publication number: 20170114243
    Abstract: Provided are hollow particles each having a shell including at least one layer, wherein the hollow particles have an average particle diameter of 10 to 200 nm and the at least one layer contains a vinyl-based resin.
    Type: Application
    Filed: January 6, 2016
    Publication date: April 27, 2017
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Yugo KATAYAMA, Kengo NISHIUMI, Ayumi KIYOHARA, Shuichi SASAHARA, Haruhiko MATSUURA, Junko KUBO