Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

Abstract: A security test can be performed on an ECU by using random test signals without changing the ECU. A security test system for a control device for an on-vehicle network, includes a security test unit that includes a test signal transmission portion transmitting random test signals including an illegal signal, for diagnosing security of a control device for an on-vehicle network, and a diagnosis portion specifying the illegal signal on the basis of a process result in the control device using the test signals, and a function evaluation unit that includes a process information acquisition portion acquiring information regarding the process result in the control device, an abnormality detection portion detecting abnormality in the process result in the control device based on the test signal, and an abnormality information output portion outputting information regarding the detected abnormality.

Abstract: A security test can be performed on an ECU by using random test signals without changing the ECU. A security test system for a control device for an on-vehicle network, includes a security test unit that includes a test signal transmission portion transmitting random test signals including an illegal signal, for diagnosing security of a control device for an on-vehicle network, and a diagnosis portion specifying the illegal signal on the basis of a process result in the control device using the test signals, and a function evaluation unit that includes a process information acquisition portion acquiring information regarding the process result in the control device, an abnormality detection portion detecting abnormality in the process result in the control device based on the test signal, and an abnormality information output portion outputting information regarding the detected abnormality.

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

Abstract: A mold package being a half-mold type includes: a substrate includes a first face and a second face; an electronic component that is mounted on the first face; and a mold resin that is provided on the first face and seals the first face with the electronic component. The second face is exposed from the mold resin. The mold resin is disposed on the first face so as to seal a sealed portion and to expose a remaining part of the first face as an exposure portion. One side face is provided by an end side face. One side face is provided by a boundary side face. At least a site on a lower end of the boundary side face is provided by an inclined face. In the boundary side face, a site on an upper end side is provided by an other inclined face having a second inclination angle.

Abstract: A mold package being a half-mold type includes: a substrate includes a first face and a second face; an electronic component that is mounted on the first face; and a mold resin that is provided on the first face and seals the first face with the electronic component. The second face is exposed from the mold resin. The mold resin is disposed on the first face so as to seal a sealed portion and to expose a remaining part of the first face as an exposure portion. One side face is provided by an end side face. One side face is provided by a boundary side face. At least a site on a lower end of the boundary side face is provided by an inclined face. In the boundary side face, a site on an upper end side is provided by an other inclined face having a second inclination angle.

Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract: A circuit board comprises wiring parts containing silver on a substrate, and a conductivity suppressing agent such as a potassium compound provided between the wiring parts, for preventing the silver attached on the substrate between the wiring parts from being conductive. Therefore, the insulation deterioration between the wiring parts can be suitably suppressed, which usually occurs when a voltage is applied between the wiring parts containing silver on the substrate under a high temperature atmosphere, irrespective of the presence or absence of water or water vapor. That is, the high temperature leakage phenomenon can be suitably suppressed.

Abstract: A gold (Au) thick film land constituting a wire bonding electrode is formed by printing and sintering a gold (Au) thick film paste previously added with copper (Cu) to overlap with a copper (Cu) thick film which is formed as a wiring layer on a ceramic substrate. A semiconductor part mounted on the substrate and the gold (Au) thick film land are directly connected by a gold (Au) wire thereby electrically connecting the semiconductor part and the copper (Cu) thick film. In forming the gold (Au) thick film land, the gold (Au) thick film paste previously added with copper (Cu) is used. Therefore, disconnection caused by the Kirkendoll phenomenon is restrained and stable bonding between the copper (Cu) wiring layer and the gold (Au) thick film land can be achieved.

Abstract: A pair of semispherical molds, each having dimple-forming projections on a connecting portion is used to shape a resinous material into a golf ball having dimples on a seam corresponding to the connecting portion. A ball fixing means is utilized to hold the golf ball thereto with the seam uncovered. A cutting member disposed at an end of a rotary shaft, and having a radius of curvature smaller than a sectional radius of curvature of the dimple is utilized to remove a burr from the seam of the golf ball. The rotary shaft rotates on its axis and moves forward when the cutting member is brought into contact with the dimple on the seam and backward when the cutting member is brought into contact with a convex land portion. The cutting member is then pressed against the seam successively in alternate contact with the dimples and the land portions.

Abstract: An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

Abstract: An apparatus for removing the burr from the seam of a golf ball made using a pair of semispherical molds each having dimple-forming projections on a connecting portion to shape resin into a golf ball having dimples on a seam corresponding to the connecting portion. A ball fixing mechanism holds the golf ball thereto with the seam uncovered. A cutting member having a cutting member, disposed at an end of a rotary shaft, having a radius of curvature smaller than a sectional radius of curvature of each of the dimples. The rotary shaft rotates on its axis and moves forward when the cutting member is brought into contact with each of the dimples on the seam and backward when the cutting member is brought into contact with a convex land thereon. Thereafter, the cutting member is pressed against the seam successively removing the burr while maintaining the integrity of each of the dimples.

Abstract: A golf ball having a plurality of dimples on a surface thereof characterized in that more than 40% of all dimples are polygonal in shape and have a double slope in section having a straight first slope and a straight second slope continued radially inwardly from the first slope, and the gradient of the first slope of said double slope disposed in the vicinity of a dimple edge is greater than that of the second slope disposed in the vicinity of the bottom thereof.

Abstract: In a golf ball having dimples and lands other than the dimples formed on the surface thereof, dimples are arranged so that less than 40 lands are provided which contain a rectangle having a short side greater than 0.4 mm and an area greater than 0.8 mm.sup.2 and not including a part of the dimple or the whole thereof. A land having the greatest area of all lands is so small that a dimple having an area greater than the average area of all dimples cannot be formed therein.