Patents by Inventor Kengo Onaka
Kengo Onaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220158349Abstract: An antenna module includes a multilayer substrate having a first main surface and a second main surface opposing to each other, a patch antenna formed on a side of the first main surface of the multilayer substrate and configured with a radiation electrode and a ground electrode, an RFIC formed on a side of the second main surface of the multilayer substrate, a first filter, and a second filter different from the first filter, wherein the patch antenna has a first feed point and a second feed point provided at different positions in the radiation electrode, the first feed point is electrically connected to the RFIC via the first filter, the second feed point is electrically connected to the RFIC via the second filter, and the first filter and the second filter are formed in the multilayer substrate.Type: ApplicationFiled: January 28, 2022Publication date: May 19, 2022Inventors: Kengo ONAKA, Yoshiki YAMADA, Keiichi HIROSE, Hirotsugu MORI
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Patent number: 11336030Abstract: An antenna module (100) includes an antenna element (121), a dielectric substrate (150) on which the antenna element (121) is arranged, and a flexible substrate (160) having a first surface and a second surface. The flexible substrate (160) has a first portion (165), a bent portion (166) bent from the first portion (165) such that the first surface is located in an outer side portion, and a flat second portion (167) extending further from the bent portion (166). The dielectric substrate (150) is arranged on the first surface of the second portion (167). The dielectric substrate (150) has a projection portion (152) projecting from a contact surface between the dielectric substrate (150) and the flexible substrate (160) toward a side of the first portion (165) along the second portion (167). At least part of the antenna element (121) is arranged on the projection portion (152).Type: GrantFiled: August 19, 2020Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takaki Murata, Kengo Onaka, Hirotsugu Mori
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Patent number: 11322819Abstract: An antenna module according to an embodiment of the present disclosure includes a dielectric substrate, a first antenna element, a first radio-frequency element, and a first heat-dissipating component. The first antenna element is provided on the dielectric substrate. The first radio-frequency element supplies electric power to the first antenna element. The first heat-dissipating component directs heat from the first radio-frequency element to the outside. The dielectric substrate, the first radio-frequency element, and the first heat-dissipating component are stacked in this order in the Z-axis direction, which is the direction normal to the dielectric substrate. The first heat-dissipating component includes metal. The first heat-dissipating component has a first width at its first position that differs from a second width at its second position located away from the first position in the Z-axis direction.Type: GrantFiled: August 27, 2020Date of Patent: May 3, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Kuniaki Yosui, Hirotsugu Mori
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Publication number: 20220094074Abstract: An antenna module includes feeding elements arranged adjacent to each other and filters connected to the respective feeding elements. Each of the filters includes a plurality of resonant lines that is not connected to each other. The filters are arranged between the feeding elements so as to cross a virtual line equidistant from the feeding elements when the antenna module is viewed in plan from the normal direction.Type: ApplicationFiled: December 7, 2021Publication date: March 24, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotsugu Mori, Tadashi Sugahara, Kengo Onaka
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Patent number: 11283191Abstract: In an antenna array of the present disclosure, in a plan view from a direction that is normal to an isolation element, the isolation element is formed between a first antenna element and a second antenna element. A first distance between the first antenna element and a first ground electrode is different from a second distance between the isolation element and the first ground electrode. A third distance between the second antenna element and the first ground electrode is different from the second distance. In a plan view from a direction that is normal to the first antenna element, the isolation element is spaced apart from the first antenna element. In a plan view from a direction that is normal to the second antenna element, the isolation element is spaced apart from the second antenna element.Type: GrantFiled: June 26, 2020Date of Patent: March 22, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Tadashi Sugahara, Yoshiki Yamada, Hirotsugu Mori
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Patent number: 11271315Abstract: An antenna module includes a multilayer substrate having a first main surface and a second main surface opposing to each other, a patch antenna formed on a side of the first main surface of the multilayer substrate and configured with a radiation electrode and a ground electrode, an RFIC formed on a side of the second main surface of the multilayer substrate, a first filter, and a second filter different from the first filter, wherein the patch antenna has a first feed point and a second feed point provided at different positions in the radiation electrode, the first feed point is electrically connected to the RFIC via the first filter, the second feed point is electrically connected to the RFIC via the second filter, and the first filter and the second filter are formed in the multilayer substrate.Type: GrantFiled: March 13, 2020Date of Patent: March 8, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Yoshiki Yamada, Keiichi Hirose, Hirotsugu Mori
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Patent number: 11251526Abstract: An antenna device is enclosed in a housing. The antenna device includes a dielectric substrate in which a plurality of layers including a ground layer is stacked on top of one another, a feed element, a parasitic element, a feed line, and a conductive member placed in or on the dielectric substrate. The feed element is placed within or on a surface of the housing, and the parasitic element is placed in the dielectric substrate. The feed line is placed, in the dielectric substrate, in a layer between a layer in which the parasitic element is placed and the ground layer and sends a radio frequency signal. When the dielectric substrate is attached to the housing, the conductive member electrically connects the feed line and the feed element and supplies a radio frequency signal to the feed element.Type: GrantFiled: January 10, 2020Date of Patent: February 15, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Kaoru Sudo, Hirotsugu Mori
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Patent number: 11228076Abstract: The present disclosure relates to an interposer (120), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer (120) includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (123), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub (124) is formed.Type: GrantFiled: July 15, 2020Date of Patent: January 18, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tadashi Sugahara, Takaaki Ishii, Kengo Onaka
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Publication number: 20210336348Abstract: The present disclosure reduces a loss of strength of a radio-frequency signal radiated from an antenna module covered with a housing. An antenna module (100) includes a dielectric substrate (130), a driven element (141), and a ground conductor (190). The dielectric substrate (130) has a multilayer structure. The driven element (141) is disposed in or on the dielectric substrate (130). The ground conductor (190) is disposed between the driven element (140) and a mounting surface (132) on which a power supply circuit is mountable. The power supply circuit supplies the driven element (140) with radio-frequency power. The dielectric substrate has at least one groove (150). The at least one groove (150) is separate from the driven element (140) when the antenna module (100) is viewed in plan. The at least one groove (150) extends toward the ground conductor (190) from a layer on which the driven element (140) is disposed.Type: ApplicationFiled: July 8, 2021Publication date: October 28, 2021Inventors: Kaoru SUDO, Kengo ONAKA, Hirotsugu MORI
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Publication number: 20210320429Abstract: A communication device includes: an antenna module that radiates a radio wave of a frequency higher than 6 GHz; a mounting substrate to which the antenna module is connected; and a housing that accommodates the mounting substrate. A display screen is formed on a portion of the housing. The housing includes a first surface and a second surface and has a substantially rectangular shape including a first long side, a second long side, a first short side, and a second short side in plan view in a normal direction of the first surface. The display screen is formed on the second surface side. The antenna module is arranged along the first long side of the housing and radiates a radio wave in two directions that are a normal direction of the first surface and a normal direction of a lateral surface along the first long side.Type: ApplicationFiled: June 25, 2021Publication date: October 14, 2021Inventors: Keisei TAKAYAMA, Kengo ONAKA, Hirotsugu MORI
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Patent number: 11146303Abstract: An antenna module includes a substrate, a RF signal processing circuit provided on the substrate, a ground electrode provided on the substrate above the RF signal processing circuit, a radiation electrode provided on the substrate above the ground electrode, and a feed line provided in an overlapping area where the radiation electrode and the RF signal processing circuit overlap, the feed line connecting the radiation electrode and the RF signal processing circuit, wherein the ground electrode includes a first ground pattern, a second ground pattern, and a peripheral wall connecting the first ground pattern and the second ground pattern, the peripheral wall surrounds part of the feed line, and the second ground pattern has a through hole through which the feed line penetrates.Type: GrantFiled: January 2, 2020Date of Patent: October 12, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Yoshiki Yamada, Keisei Takayama, Hirotsugu Mori
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Publication number: 20210194126Abstract: An antenna module includes a dielectric substrate having a multilayer structure, a power supply element and a ground electrode (GND) disposed in or on the dielectric substrate, a parasitic element, a power supply wiring line, and first and second stubs to be connected to the power supply wiring line. The parasitic element is disposed in a layer between the power supply element and the ground electrode (GND). The power supply wiring line passes through the parasitic element and supplies radio frequency power to the power supply element. The first stub is connected to a position different from a connection position of the second stub in the power supply wiring line.Type: ApplicationFiled: March 4, 2021Publication date: June 24, 2021Inventors: Kaoru SUDO, Kengo ONAKA, Hirotsugu MORI
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Publication number: 20210167506Abstract: An antenna element includes a dielectric substrate, a first ground electrode, a second ground electrode, a via conductor, and a radiation electrode. The dielectric substrate includes a first portion shaped like a flat plate and a second portion thinner than the first portion. The first ground electrode is arranged in the first portion. The second ground electrode is arranged in the second portion. The via conductor couples the first ground electrode and the second ground electrode. A distance between the radiation electrode and the first ground electrode in a first thickness direction is more than a distance between the radiation electrode and the second ground electrode in a second thickness direction. Part of the radiation electrode lies opposite to the first ground electrode without lying opposite to the second ground electrode.Type: ApplicationFiled: February 8, 2021Publication date: June 3, 2021Inventors: Kaoru SUDO, Hirotsugu MORI, Kengo ONAKA
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Patent number: 11024955Abstract: An antenna module includes a dielectric substrate, a radiation electrode formed on the front face of the dielectric substrate, an RFIC and a ground electrode formed on the rear face of the dielectric substrate, a ground line arranged in the dielectric substrate, and a power supply line including a power supply line portion arranged in parallel to a main surface of the dielectric substrate. The ground electrode is arranged between the power supply line portion and the RFIC. The ground line is arranged between the power supply line portion and the radiation electrode. The ground electrode includes the radiation electrode and part of the power supply line portion in a plan view. The ground line includes part of the power supply line portion in the plan view. The area in which the ground line is formed is smaller than the area in which ground electrode is formed.Type: GrantFiled: January 22, 2020Date of Patent: June 1, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Yoshiki Yamada, Hirotsugu Mori
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Publication number: 20210151874Abstract: An antenna module includes a first antenna element disposed at a first dielectric substrate, a second antenna element disposed at a second dielectric substrate, a joint connecting the first dielectric substrate and the second dielectric substrate, and a power supply line. The second dielectric substrate is different from the first dielectric substrate with respect to the normal direction. The power supply line extends from the first dielectric substrate via the joint to the second antenna element and is configured to communicate a radio-frequency signal to the second antenna element. At least a part of the power supply line at the joint is formed in a direction crossing the polarization plane of radio waves radiated by the first antenna element and the second antenna element.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Inventors: Kaoru SUDO, Yoshiki YAMADA, Kengo ONAKA, Hirotsugu MORI
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Patent number: 11011843Abstract: A patch antenna includes a power feeding conductor pattern formed in a dielectric layer, a ground conductor pattern formed on the dielectric layer, a first parasitic conductor pattern and a second parasitic conductor pattern formed in/on the dielectric layer and is not set to have a ground potential. The first parasitic conductor pattern, the power feeding conductor pattern, the second parasitic conductor pattern, and the ground conductor pattern are arranged in this order in a cross section and overlap each other in a plan view. A resonant frequency f1 defined by an opposite-phase mode current flowing through the first parasitic conductor pattern is higher than a resonant frequency f2 defined by an in-phase mode current flowing through the power feeding conductor pattern, and a resonant frequency f3 defined by an opposite-phase mode current flowing through the second parasitic conductor pattern is lower than the resonant frequency f2.Type: GrantFiled: March 25, 2019Date of Patent: May 18, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Yoshiki Yamada
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Publication number: 20210143531Abstract: An antenna element includes a dielectric substrate, a radiation electrode, a first ground electrode, a second ground electrode, and a via conductor that connects the first ground electrode and the second ground electrode to each other. The dielectric substrate includes a flat-plate-shaped first part and a second part that is thinner than the first part. The radiation electrode and the first ground electrode are arranged on or in the first part so as to face each other in the thickness direction of the first part. The second ground electrode is spaced apart from the radiation electrode. The second ground electrode is arranged on or in the second part so as to not face the radiation electrode in the thickness direction of the second part. The radiation electrode is capacitively coupled to the second ground electrode and the via conductor.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Inventors: Kaoru SUDO, Hirotsugu MORI, Kengo ONAKA, Tadashi SUGAHARA
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Patent number: 10998630Abstract: An antenna module includes a dielectric substrate having a multilayer structure, a power supply element and a ground electrode (GND) disposed in or on the dielectric substrate, a parasitic element, a power supply wiring line, and first and second stubs to be connected to the power supply wiring line. The parasitic element is disposed in a layer between the power supply element and the ground electrode (GND). The power supply wiring line passes through the parasitic element and supplies radio frequency power to the power supply element. The first stub is connected to a position different from a connection position of the second stub in the power supply wiring line.Type: GrantFiled: September 23, 2020Date of Patent: May 4, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kaoru Sudo, Kengo Onaka, Hirotsugu Mori
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Publication number: 20210126366Abstract: An antenna device includes a ground electrode, a feed element, and a parasitic element. The ground electrode has a substantially non-square rectangular plane shape that includes a first side extending in a first direction and a second side extending in a second direction orthogonal to the first direction. The feed element has a substantially rectangular plane shape and is formed in such a way that each side of the feed element becomes parallel to the first direction or the second direction. The parasitic element is formed in such a manner as to face a side of the feed element parallel to the first side. The feed element is configured to radiate a first polarized wave that excites in the first direction and a second polarized wave that excites in the second direction. The length of the first side is longer than the length of the second side.Type: ApplicationFiled: January 4, 2021Publication date: April 29, 2021Inventors: Kaoru Sudo, Kengo Onaka
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Patent number: 10950945Abstract: A patch antenna (10) includes a planar first power feeding conductor pattern (11) that is formed on a dielectric substrate (20) and to which a radio frequency signal is fed, a planar second power feeding conductor pattern (12) that is formed on the dielectric substrate (20) and is arranged to be isolated from the first power feeding conductor pattern (11) so as to interpose the first power feeding conductor pattern (11) in the polarization direction when the dielectric substrate (20) is seen in a plan view, and a planar ground conductor pattern (13) that is formed on the dielectric substrate (20) so as to face the first power feeding conductor pattern (11) and the second power feeding conductor pattern (12) and is set to have a ground potential, wherein the second power feeding conductor pattern (12) is not set to have the ground potential.Type: GrantFiled: April 2, 2019Date of Patent: March 16, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kengo Onaka, Yoshiki Yamada