Patents by Inventor Kengo SHINOHARA

Kengo SHINOHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition and coupling structure
    Patent number: 11887748
    Abstract: A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: January 30, 2024
    Inventors: Tomoki Morijiri, Kengo Shinohara, Ayao Matsukawa
  • Electroconductive film, roll, connected structure, and process for producing connected structure
    Patent number: 11667817
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 6, 2023
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Takashi Tatsuzawa, Kazuya Matsuda, Yutaka Tsuchida, Takashi Seki, Mitsuyoshi Shimamura, Kengo Shinohara, Tetsuyuki Shirakawa, Yasunori Kawabata, Satoru Matsumoto
  • ADHESIVE COMPOSITION AND COUPLING STRUCTURE
    Publication number: 20230146296
    Abstract: A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.
    Type: Application
    Filed: February 17, 2021
    Publication date: May 11, 2023
    Inventors: Tomoki MORIJIRI, Kengo SHINOHARA, Ayao MATSUKAWA
  • ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
    Publication number: 20230137299
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO
  • ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
    Publication number: 20190241771
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Application
    Filed: September 26, 2017
    Publication date: August 8, 2019
    Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO