Patents by Inventor Kengo Takemasa

Kengo Takemasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10411715
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: September 10, 2019
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Publication number: 20190190449
    Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
    Type: Application
    Filed: February 15, 2019
    Publication date: June 20, 2019
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
  • Patent number: 10243515
    Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: March 26, 2019
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
  • Publication number: 20180076817
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Application
    Filed: November 3, 2017
    Publication date: March 15, 2018
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Publication number: 20180006604
    Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
    Type: Application
    Filed: August 31, 2017
    Publication date: January 4, 2018
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
  • Patent number: 9838022
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: December 5, 2017
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Patent number: 9787250
    Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: October 10, 2017
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
  • Publication number: 20170126233
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Application
    Filed: January 13, 2017
    Publication date: May 4, 2017
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Patent number: 9584134
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 28, 2017
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Publication number: 20160155690
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Application
    Filed: January 18, 2016
    Publication date: June 2, 2016
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Publication number: 20160118938
    Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
    Type: Application
    Filed: January 4, 2016
    Publication date: April 28, 2016
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
  • Publication number: 20160049944
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Application
    Filed: October 29, 2015
    Publication date: February 18, 2016
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Patent number: 9257377
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 9, 2016
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Patent number: 9230890
    Abstract: A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: January 5, 2016
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
  • Patent number: 9197217
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: November 24, 2015
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Publication number: 20150076673
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction: a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Application
    Filed: November 25, 2014
    Publication date: March 19, 2015
    Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Patent number: 8921987
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 30, 2014
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Publication number: 20130285224
    Abstract: A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.
    Type: Application
    Filed: April 25, 2013
    Publication date: October 31, 2013
    Applicant: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
  • Publication number: 20130285225
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Application
    Filed: April 25, 2013
    Publication date: October 31, 2013
    Applicant: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Publication number: 20130285640
    Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 31, 2013
    Applicant: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA