Patents by Inventor Kengo TANIMORI

Kengo TANIMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200146146
    Abstract: A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
    Type: Application
    Filed: September 27, 2019
    Publication date: May 7, 2020
    Inventors: Takakuni NASU, Kengo TANIMORI, Yousuke KONDO, Masahiro KAMEGAI, Kouta KIMATA, Junya MATSURA, Fumio SHIRAKI, Guangzhu JIN
  • Patent number: 9903887
    Abstract: Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: February 27, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takakuni Nasu, Kengo Tanimori, Kouta Kimata, Guangzhu Jin
  • Publication number: 20170122981
    Abstract: Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 4, 2017
    Inventors: Takakuni NASU, Kengo TANIMORI, Kouta KIMATA, Guangzhu JIN