Abstract: According to one embodiment, a semiconductor device c includes: a package substrate including a base including a mount portion, and terminals; a semiconductor chip including a first pad to which a ground voltage is supplied, a second pad electrically connected to a first terminal among the terminals, and a semiconductor circuit connected to the first and second pads, the semiconductor chip being provided above the mount portion; and a first capacitor chip including a first capacitor unit provided in a silicon substrate, a first node supplied with the ground voltage, and a second node electrically connected to the second pad, the first capacitor chip being provided above the mount portion.

Abstract: A wiring device includes: a plate having a first surface and a second surface provided above the first surface; a first protrusion provided on the second surface, the first protrusion having a side surface capable of locking a first substrate and a first upper surface including a plurality of first grooves provided parallel to a first direction, the first substrate being insertable in the first direction parallel to the second surface and being removable in a second direction opposite the first direction on the second surface and the first substrate including a terminal on a surface of the first substrate, each of the first grooves capable of accommodating a coating of a wiring including a conductor and the coating provided around the conductor, the first protrusion extending in a third direction intersecting the first direction and the second direction and the third direction being parallel to the second surface; a holder provided on the second surface, the holder including a plurality of connection portions

Abstract: According to one embodiment, a connector includes an insulating material part, and a plurality of first through conductive parts surrounded with the insulating material part, penetrating the insulating material part in a first direction, and arranged in a second direction perpendicular to the first direction, wherein each of the first through conductive parts includes a single bent portion, and the first through conductive parts are bent in the same direction.

Abstract: According to one embodiment, an interposer substrate for switching wiring lines, includes a substrate body having through holes penetrating from a first main surface thereof to a second main surface, through-conductive portions provided respectively in the through holes, grouped into first groups and second groups different from the first groups, first wiring lines each provided on the first main surface and for a respective one of the first groups, second wiring lines each provided on the second main surface and for a respective one of the second groups, first terminals provided on the first main surface and connected respectively to the first wiring lines, and second terminals provided on the second main surface and connected respectively to the second wiring lines.

Abstract: According to an embodiment, a radio communication apparatus includes a microwave radio unit, a millimeter wave radio unit, and a control unit. The microwave radio unit transmits data using microwaves. The millimeter wave radio unit transmits the data using millimeter waves. The control unit performs control of switching as to whether to transmit the data using the microwaves or the millimeter waves depending on a transmission time period calculated from a mode selected in transmitting the data using the microwaves and a size of the data.

Abstract: According to one embodiment, a connector includes an insulating material part, and a plurality of first through conductive parts surrounded with the insulating material part, penetrating the insulating material part in a first direction, and arranged in a second direction perpendicular to the first direction, wherein each of the first through conductive parts includes a single bent portion, and the first through conductive parts are bent in the same direction.

Abstract: According to one embodiment, an interposer substrate for switching wiring lines, includes a substrate body having through holes penetrating from a first main surface thereof to a second main surface, through-conductive portions provided respectively in the through holes, grouped into first groups and second groups different from the first groups, first wiring lines each provided on the first main surface and for a respective one of the first groups, second wiring lines each provided on the second main surface and for a respective one of the second groups, first terminals provided on the first main surface and connected respectively to the first wiring lines, and second terminals provided on the second main surface and connected respectively to the second wiring lines.

Abstract: A DC offset of a VGA is measured by selecting a ground contact of a switch. Then, the gain of the VGA is set at an appropriate value, monitoring contacts of the switch are successively selected, and the output values of an ADC for the respective cases are measured with the input to a DAC set at zero. Then, the DC offset of the VGA is removed, the DC offset value of each circuit block, such as DAC, in a transmitting part is calculated, and parameters are set so that the DC offset value of each circuit block is minimized.

Abstract: A DC offset of a VGA is measured by selecting a ground contact of a switch. Then, the gain of the VGA is set at an appropriate value, monitoring contacts of the switch are successively selected, and the output values of an ADC for the respective cases are measured with the input to a DAC set at zero. Then, the DC offset of the VGA is removed, the DC offset value of each circuit block, such as DAC, in a transmitting part is calculated, and parameters are set so that the DC offset value of each circuit block is minimized.

Abstract: A DC offset of a VGA is measured by selecting a ground contact of a switch. Then, the gain of the VGA is set at an appropriate value, monitoring contacts of the switch are successively selected, and the output values of an ADC for the respective cases are measured with the input to a DAC set at zero. Then, the DC offset of the VGA is removed, the DC offset value of each circuit block, such as DAC, in a transmitting part is calculated, and parameters are set so that the DC offset value of each circuit block is minimized.

Abstract: A radio-frequency circuit comprises a low-noise amplifier, an NMOS mixer for converting a radio-frequency signal output from the low-noise amplifier into an intermediate-frequency signal, a polyphase filter for removing image noises, and a PMOS mixer for converting the intermediate-frequency signal passed through the polyphase filter into a baseband signal.

Abstract: A semiconductor integrated circuit has an amplifier circuit which includes a phase compensating capacitor and has a feedback loop, and a stability determining and adjusting circuit which measures an amplitude of a voltage outputted from the amplifier circuit at a predetermined plurality of frequencies and adjusts a capacitance value of the phase compensating capacitor on the basis of a ratio between measured values of the amplitude.

Abstract: A DC offset of a VGA is measured by selecting a ground contact of a switch. Then, the gain of the VGA is set at an appropriate value, monitoring contacts of the switch are successively selected, and the output values of an ADC for the respective cases are measured with the input to a DAC set at zero. Then, the DC offset of the VGA is removed, the DC offset value of each circuit block, such as DAC, in a transmitting part is calculated, and parameters are set so that the DC offset value of each circuit block is minimized.

Abstract: A semiconductor integrated circuit has an amplifier circuit which includes a phase compensating capacitor and has a feedback loop, and a stability determining and adjusting circuit which measures an amplitude of a voltage outputted from the amplifier circuit at a predetermined plurality of frequencies and adjusts a capacitance value of the phase compensating capacitor on the basis of a ratio between measured values of the amplitude.

Abstract: A radio-frequency circuit comprises a low-noise amplifier, an NMOS mixer for converting a radio-frequency signal output from the low-noise amplifier into an intermediate-frequency signal, a polyphase filter for removing image noises, and a PMOS mixer for converting the intermediate-frequency signal passed through the polyphase filter into a baseband signal.

Abstract: A data transfer circuit includes data lines for transferring data, interface input/output blocks connected to the data lines for input or output of data through the data lines, and a leakage current monitor and compensate circuit connected to the data lines to detect and store magnitudes of leakage currents in the data lines before input or output of data, and generate and supply to the data lines compensation currents that compensate the leakage currents upon input or output of data. An example of the data line is a bit line of a memory, and an example of the interface input/output block is a memory cell.

Abstract: A data transfer circuit includes data lines for transferring data, interface input/output blocks connected to the data lines for input or output of data through the data lines, and a leakage current monitor and compensate circuit connected to the data lines to detect and store magnitudes of leakage currents in the data lines before input or output of data, and generate and supply to the data lines compensation currents that compensate the leakage currents upon input or output of data. An example of the data line is a bit line of a memory, and an example of the interface input/output block is a memory cell.