Abstract: A method of producing component-attached vehicle window glass includes disposing a component on a main surface of a glass plate having a heat absorbing layer via an adhesive, locally heating the heat absorbing layer, and transferring heat from the heat absorbing layer to the adhesive to heat and cure the adhesive.

Abstract: A method of producing metal component-attached vehicle window glass includes disposing a metal component on a main surface of window glass via an adhesive, locally heating the metal component, and transferring heat from the metal component to the adhesive to heat and cure the adhesive.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a reflectivity greater than or equal to 5% and less than or equal to 90%, and a front haze less than or equal to 30.

Abstract: A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a front haze greater than or equal to 4 and less than or equal to 40, and a rear haze greater than or equal to 0 and less than or equal to 60. In a case where light is incident on a surface of the substrate at an angle of 45°, an intensity of a backward scattering light is lower than an intensity of a frontward scattering light.

Abstract: A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a reflectivity greater than or equal to 5% and less than or equal to 90%, and a front haze less than or equal to 30.

Abstract: A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a front haze greater than or equal to 4 and less than or equal to 40, and a rear haze greater than or equal to 0 and less than or equal to 60. In a case where light is incident on a surface of the substrate at an angle of 45° an intensity of a backward scattering light is lower than an intensity of a frontward scattering light.

Abstract: The present invention relates to a resin layer-attached supporting substrate and particularly relates to a resin layer-attached supporting substrate which includes a layer of a polyimide resin produced using a predetermined method. Further, the present invention relates to a method for producing the resin layer-attached supporting substrate, a glass laminate which includes the resin layer-attached supporting substrate and a method for producing the same, and a method for producing an electronic device.

Abstract: The present invention relates to a flexible substrate and particularly relates to a flexible substrate which includes a resin layer of a polyimide resin produced using a predetermined method. Further, the present invention relates to a method for producing the flexible substrate, a glass laminate which includes the flexible substrate and a method for producing the same, and a method for producing an electronic device.

Abstract: The present invention has an object to provide a glass laminate in which a glass substrate can be easily peeled even after a long-time treatment under high temperature conditions. The present invention relates to a glass laminate including: an inorganic layer-attached supporting substrate including a supporting substrate and an inorganic layer containing at least one kind selected from the group consisting of a metal silicide, a nitride, a carbide and a carbonitride, arranged on the supporting substrate; and a glass substrate peelably laminated on the inorganic layer.

Abstract: A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: Disclosed is a glass laminate comprising a thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer and an outer frame layer arranged between the thin glass substrate and the supporting glass substrate. The resin layer is fixed to the first main surface of the supporting glass substrate and is in close contact with the first main surface of the thin glass substrate, while having easy releasability from the first main surface of the thin glass substrate. The outer frame layer surrounds the resin layer on the first main surface of the supporting glass substrate so that the outside air does not come into contact with the resin layer.

Abstract: A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

Abstract: The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or the like.