Patents by Inventor Kenichi Fukami
Kenichi Fukami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230249292Abstract: Provided is a laser machining method with which strain occurring in a workpiece can be reduced even when a large number of through-holes are formed. The laser machining method includes: a gas supply step (S3) of making a gas pressure on the back surface side of a workpiece 1 higher than a gas pressure on the front surface side of the workpiece 1; a deep hole machining step (S5) of irradiating the workpiece 1 from the front surface side with a pulsed laser having a first repetition frequency f1, thereby forming through-holes A in the workpiece 1; and a hole finishing step (S7) of irradiating the inner surface of the through-holes A with a pulsed laser having a second repetition frequency f2 that is lower than the first repetition frequency f1.Type: ApplicationFiled: March 30, 2021Publication date: August 10, 2023Inventors: Takashi Kobayashi, Naruhiko Okubo, Kenichi Fukami, Seiichi Kouketsu
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Patent number: 11717917Abstract: A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.Type: GrantFiled: March 31, 2021Date of Patent: August 8, 2023Assignee: Honda Motor Co., Ltd.Inventors: Takashi Kobayashi, Naruhiko Okubo, Kenichi Fukami, Seiichi Kouketsu, Kenji Sugai
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Publication number: 20230234166Abstract: A joined member is provided which includes: a first metal member, a second metal member opposed to the first metal member, and a joining portion through which the first metal member and the second metal member are joined together, in which an end face in a width direction of the first metal member is in contact with the joining portion, a portion of a surface of the second metal member on a side opposed to the first metal member is in contact with the joining portion, and a region of the surface of the second metal member on a side opposed to the first metal member which is not in contact with the joining portion is covered with zinc, and in the joining portion, zinc concentration in at least one end portion in the width direction is higher than zinc concentration in the center portion in the width direction.Type: ApplicationFiled: November 30, 2022Publication date: July 27, 2023Inventors: Masaaki FUJIMOTO, Seiya OKAMURA, Kenichi FUKAMI
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Patent number: 11173573Abstract: Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.Type: GrantFiled: September 16, 2016Date of Patent: November 16, 2021Assignee: Honda Motor Co., Ltd.Inventors: Takanori Sato, Shin Yoshida, Masahiro Koike, Kenichi Fukami
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Publication number: 20210299793Abstract: A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.Type: ApplicationFiled: March 31, 2021Publication date: September 30, 2021Applicant: Honda Motor Co., Ltd.Inventors: Takashi KOBAYASHI, Naruhiko OKUBO, Kenichi FUKAMI, Seiichi KOUKETSU, Kenji SUGAI
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Publication number: 20210283748Abstract: A drilling method capable of preventing hole clogging easily and at low cost is provided. A drilling method of the disclosure includes: a hole forming step in which a surface of a workpiece is drilled to form at least one penetration hole from the surface to a back surface of the workpiece; a liquid intrusion step in which the workpiece is immersed in a tank containing a liquid, and the inside of the tank is decompressed to a predetermined pressure to allow the liquid to intrude into the penetration holes; a liquid solidification step in which the liquid that has intruded into the penetration holes is solidified after the workpiece is taken out of the tank; and a burr removing step in which the surface of the workpiece is blasted to remove burrs formed around openings of the penetration holes.Type: ApplicationFiled: March 12, 2021Publication date: September 16, 2021Applicant: Honda Motor Co., Ltd.Inventors: Naruhiko OKUBO, Takashi KOBAYASHI, Kenichi FUKAMI, Seiichi KOUKETSU
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Publication number: 20180257177Abstract: Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.Type: ApplicationFiled: September 16, 2016Publication date: September 13, 2018Inventors: Takanori SATO, Shin YOSHIDA, Masahiro KOIKE, Kenichi FUKAMI
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Patent number: 9120185Abstract: A workpiece support apparatus is provided with a plurality of support members. The support members support a workpiece. Each support member moves along a moving path to a machining position while the support member is held at a first holding position for supporting the workpiece or a second holding position which is spaced apart from the first holding position. At least one support member is displaced from the first holding position to the second holding position or from the second holding position to the first holding position along a machining trajectory, before the support member arrives at the machining position whenever each support member is moved to the machining position.Type: GrantFiled: January 9, 2013Date of Patent: September 1, 2015Assignee: HONDA MOTOR CO., LTD.Inventors: Takuo Kobayashi, Izuru Hori, Kenichi Fukami, Masahiro Koike, Shin Yoshida
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Patent number: 8946587Abstract: A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.Type: GrantFiled: August 27, 2012Date of Patent: February 3, 2015Assignee: Honda Motor Co., Ltd.Inventors: Takuo Kobayashi, Shin Yoshida, Izuru Hori, Masahiro Koike, Kenichi Fukami
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Patent number: 8794431Abstract: A conveyor system is provided with a plurality of support members which are erected and spaced apart from each other, a plurality of holding units on which the plurality of support members are held, and a drive unit that moves the holding units in a conveying direction. A supporting plane on which a workpiece is supported and conveyed is formed by distal end portions of the support members. The support members are movable in parallel with respect to the supporting plane.Type: GrantFiled: August 19, 2011Date of Patent: August 5, 2014Assignee: Honda Motor Co., Ltd.Inventors: Takuo Kobayashi, Izuru Hori, Shin Yoshida, Kenichi Fukami
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Publication number: 20130098876Abstract: A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.Type: ApplicationFiled: August 27, 2012Publication date: April 25, 2013Applicant: HONDA MOTOR CO., LTD.Inventors: Takuo Kobayashi, Shin Yoshida, Izuru Hori, Masahiro Koike, Kenichi Fukami
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Patent number: 8138447Abstract: A laser-arc hybrid welding head performs laser light irradiation and arc discharge of a base material to weld the base material by combined use of laser welding and arc welding. The welding head includes an optical fiber for transmitting laser light used in laser welding and an arc electrode for generating an arc between the arc electrode and the base material. The optical fiber is disposed such that an optical axis thereof crosses an axis of the arc electrode at a predetermined angle.Type: GrantFiled: December 12, 2008Date of Patent: March 20, 2012Assignees: Mitsubishi Heavy Industries, Ltd., Honda Motor Co., Ltd.Inventors: Masao Watanabe, Kenichi Fukami, Keishi Setoda
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Publication number: 20120055762Abstract: A conveyor system is provided with a plurality of support members which are erected and spaced apart from each other, a plurality of holding units on which the plurality of support members are held, and a drive unit that moves the holding units in a conveying direction. A supporting plane on which a workpiece is supported and conveyed is formed by distal end portions of the support members. The support members are movable in parallel with respect to the supporting plane.Type: ApplicationFiled: August 19, 2011Publication date: March 8, 2012Applicant: HONDA MOTOR CO., LTD.Inventors: Takuo Kobayashi, Izuru Hori, Shin Yoshida, Kenichi Fukami
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Publication number: 20090212028Abstract: A laser-arc hybrid welding head for performing laser light irradiation and arc discharge of a base material to weld the base material by combined use of laser welding and arc welding, comprising: an optical fiber for transmitting laser light used in laser welding; and an arc electrode for generating an arc between the arc electrode and the base material, wherein the optical fiber is disposed such that an optical axis thereof crosses an axis of the arc electrode at a predetermined angle.Type: ApplicationFiled: December 12, 2008Publication date: August 27, 2009Inventors: Masao Watanabe, Kenichi Fukami, Keishi Setoda