Patents by Inventor Kenichi Fuke

Kenichi Fuke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method of manufacturing electronic device
    Patent number: 8497166
    Abstract: An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is bonded is covered with a synthetic resin (130) is manufactured by injecting an amount of synthetic resin (130) into the case (110) such that at least a portion of the metal wire (119) is exposed from a top surface of the synthetic resin (130); and leaving the case (110) to which the synthetic resin (130) is injected under reduced pressure so as to raise a liquid surface of the synthetic resin (130) due to the reduced pressure, and covering the metal wire (119) exposed from the top surface of the synthetic resin (130) with the synthetic resin (30, 130).
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: July 30, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hirokazu Umemura, Kenichi Fuke
  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20120146232
    Abstract: An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is bonded is covered with a synthetic resin (130) is manufactured by injecting an amount of synthetic resin (130) into the case (110) such that at least a portion of the metal wire (119) is exposed from a top surface of the synthetic resin (130); and leaving the case (110) to which the synthetic resin (130) is injected under reduced pressure so as to raise a liquid surface of the synthetic resin (130) due to the reduced pressure, and covering the metal wire (119) exposed from the top surface of the synthetic resin (130) with the synthetic resin (30, 130).
    Type: Application
    Filed: August 24, 2010
    Publication date: June 14, 2012
    Applicant: Honda Motor Co., Ltd.
    Inventors: Hirokazu Umemura, Kenichi Fuke