Patents by Inventor Kenichi Fukukawa

Kenichi Fukukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE COMPOSITE MATERIAL AND FILM THEREOF
    Publication number: 20100304160
    Abstract: A polyamic acid solution according to the present invention includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite according to the present invention is produced from the polyamic acid solution. The present invention provides a polyimide composite having a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
    Type: Application
    Filed: November 27, 2008
    Publication date: December 2, 2010
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Yoshihiro Sakata, Ichiro Fujio, Wataru Yamashita