Abstract: A molding method integrally molds thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility into a three-dimensional shape. The molding method includes the steps of determining an unfolded shape and circuit arrangement of the flexible substrate corresponding to the three-dimensional shape, elastically deforming and holding the flexible substrate along a resin filling space of a mold while the mold is being opened, and closing the mold and filling the resin filling space with thermoplastic resin.

Abstract: A method for manufacturing a molded product with fine structure includes steps of, in a temperature-controlled stamper mold provided with a fine structure including a concavo-convex pattern having a width of 10 nm to 1 ?m, forming a thermoplastic molten polymer layer to be in contact with the fine structure 20 of the stamper mold having been kept at a predetermined temperature and holding the thermoplastic molten polymer layer for a predetermined time so as to transfer the fine structure of the stamper mold to the thermoplastic molten polymer layer under gravity.

Abstract: The present invention is widely applicable to an injection molding method, an injection compression molding method, a blow molding method, a film sheet molding method using a roller and a thermoplastic molten polymer, and the like. An object of the invention is to provide a method for manufacturing a molded product with fine structure, which can transfer-mold a fine structure using any of various thermoplastic molten polymers without particularly requiring a pressurizing apparatus and can afford a nano-scaled fine pattern having a high economical efficiency, a large area, and homogeneous properties.