Abstract: An approach is provided in which the approach captures a set of individual indices corresponding to a set of psychological conditions of individual members of a team during a set of phases of a project. The approach computes, based on the set of individual indices, a set of team indices corresponding to the set of psychological conditions indicating a team state in each one of the set of phases of the project. The approach transmits a recommendation to a user in response to detecting a set of differences between the set of team indices and a set of expected values. The recommendation includes an action to increase the set of team indices.

Abstract: A power semiconductor apparatus includes a mold portion, a panel that is conductive and in a flat plate shape, and a plurality of fins. The mold portion includes a power semiconductor element and a base plate that are molded. An opening is formed in the panel into which the base plate is inserted. The plurality of fins is fixed in grooves of the base plate. The panel has a plurality of protrusions on side surfaces forming the opening. Each protrusion has a fifth surface a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes. The base plate has cover portions covering the fifth surfaces, and is plastically deformed to allow the panel to be fitted in the base plate to fill gaps.

Abstract: Please replace the currently pending Abstract with the following amended A parasitic capacitance of a wiring arranged on a back surface side of a semiconductor substrate is reduced. A semiconductor apparatus includes a semiconductor substrate, a back surface side wiring, a through wiring, and a separation region. In the semiconductor substrate, a semiconductor element and a front surface side wiring connected to the semiconductor element are arranged on a front surface side. The back surface side wiring is arranged on a back surface side of the semiconductor substrate. The through wiring is arranged in a through hole formed in the semiconductor substrate to connect the front surface side wiring and the back surface side wiring. The separation region is arranged between the semiconductor substrate and the back surface side wiring.

Abstract: In tracking of a moving body using image data in detecting a target moving body having few externally outstanding features, such as coloring and a shape, from an image in an image frame, if an image of the target moving body overlaps a background image largely and their colorings are the same or similar to one another, it is difficult to detect the target moving body. A template image of the target moving body is superimposed on a background image of a region (periphery) of a candidate position of the target to generate a composite image and the moving body is detected based on a degree of match calculated through comparison of the composite image with an image of the region (periphery) of the candidate position of the target.

Abstract: A tape guide includes a guide section configured to guide a carrier tape, a component exposing section configured to open a cover tape to expose an electronic component in a component storage section during conveyance of the carrier tape guided by the guide section, a tongue portion provided on the component exposing section and configured such that a distal end portion is movable between a first height position at which the distal end portion enters between a base tape and the cover tape and a second height position higher than the first height position, a pressing section placed above the tongue portion to apply a pressing force to the tongue portion to cause the tongue portion to move downward, and a stepped portion provided on a facing surface on which the tongue portion and the pressing section face each other.

Abstract: An image forming apparatus includes: a former that performs image formation on a sheet conveyed on a conveyance path; a first hardware processor that detects a type of the sheet on which the image is formed; a second hardware processor that receives specification of a type of a sheet from a user; and a third hardware processor that receives a user setting regarding the image formation, wherein the user setting includes a setting for allowing the former to continuously perform the image formation in a case where the sheet type detected by the first hardware processor is different from the sheet type specified by the user received by the second hardware processor.

Abstract: To provide a mechanism for selectively taking an external sound from an appropriate sound source into an internal space of a moving object. An information processing apparatus including an acquisition unit configured to acquire an audio signal from a sound source existing outside a moving object, a generation unit configured to generate an audio signal from a target sound source at a distance from the moving object, the distance being a distance according to a speed of the moving object, of the sound sources, on the basis of the audio signal acquired by the acquisition unit, and an output control unit configured to output the audio signal generated by the generation unit toward an internal space of the moving object.

Abstract: To provide a solid-state imaging element capable of further improving reliability. Provided is a solid-state imaging element including at least a first photoelectric conversion section, and a semiconductor substrate in which a second photoelectric conversion section is formed, in this order from a light incidence side, in which the first photoelectric conversion section includes at least a first electrode, a photoelectric conversion layer, a first oxide semiconductor layer, a second oxide semiconductor layer, and a second electrode in this order, and a film density of the first oxide semiconductor layer is higher than a film density of the second oxide semiconductor layer.

Abstract: An offset correction device includes: an amplitude adjuster that adjusts an amplitude of a detection signal output from an encoder by adjusting a gain of the detection signal so that the amplitude is within a predetermined range; an offset corrector that corrects an offset of an amplitude center of the detection signal; and a storage that stores a relationship between the gain and an offset amount in advance, wherein the offset corrector refers to the relationship stored in the storage when the amplitude adjuster changes the gain, obtains the offset amount corresponding to the changed gain, and corrects the offset based on the obtained offset amount.

Abstract: To provide a solid-state imaging element capable of further improving reliability. Provided is a solid-state imaging element including at least a first photoelectric conversion section, and a semiconductor substrate in which a second photoelectric conversion section is formed, in this order from a light incidence side, in which the first photoelectric conversion section includes at least a first electrode, a photoelectric conversion layer, a first oxide semiconductor layer, a second oxide semiconductor layer, and a second electrode in this order, and a film density of the first oxide semiconductor layer is higher than a film density of the second oxide semiconductor layer.

Abstract: A yarn containing a plurality of potential-generating filaments. The yarn is characterized in that the plurality of potential-generating filaments are constructed such that the yarn has a specific permittivity of 4.5 or less. In a specific configuration, the plurality of potential-generating filaments are constructed such that the distance between the potential-generating filaments is about 0 ?m to about 10 ?m. Also provided is a fabric that contains the yarn.

Abstract: A hydraulic control device that includes a primary pressure control valve that has a first valve element and that regulates the primary pressure by varying a position of the first valve element in accordance with operation of a first electromagnetic actuator; a secondary pressure control valve that has a second valve element and that regulates the secondary pressure by varying a position of the second valve element in accordance with operation of a second electromagnetic actuator; and a fail-safe valve that varies the position of the first valve element such that the primary pressure is reduced when the first electromagnetic actuator and the second electromagnetic actuator become inoperable.

Abstract: An object of the present invention is to provide a method for producing a bis(fluorosulfonyl)amide alkali metal salt powder having high purity while suppressing reduction in yield due to thermal decomposition, etc. The method for producing a bis(fluorosulfonyl)amide alkali metal salt powder according to the present invention comprises precipitating a bis(fluorosulfonyl)amide alkali metal salt by conducting distillation using a thin-film evaporator while adding a poor solvent for the bis(fluorosulfonyl)amide alkali metal salt such as an aromatic hydrocarbon solvent and a linear or branched aliphatic hydrocarbon solvent to a solution formed by dissolving the bis(fluorosulfonyl)amide alkali metal salt in a good solvent for the bis(fluorosulfonyl)amide alkali metal salt such as an ester solvent and nitrile solvent.

Abstract: A reinforcing film comprises a pressure sensitive adhesive layer laminated and fixed on a principal surface of a film substrate. The pressure sensitive adhesive layer is formed of a photocurable composition containing a photocurable agent and a base polymer having a crosslinked structure. A frictional force of the pressure sensitive adhesive layer measured with a frictional force microscope at a frequency of 5 Hz is preferably 2 to 5 times a frictional force at a frequency of 0.1 Hz. After photocuring of the pressure sensitive adhesive layer, a frictional force of a photocured pressure sensitive adhesive layer measured with the frictional force microscope at a frequency of 5 Hz is preferably not less than 5 times a frictional force measured at a frequency of 0.1 Hz.

Abstract: A power semiconductor apparatus includes a mold portion, a panel that is conductive and in a flat plate shape, and a plurality of fins. The mold portion includes a power semiconductor element and a base plate that are molded. An opening is formed in the panel into which the base plate is inserted. The plurality of fins is fixed in grooves of the base plate. The panel has a plurality of protrusions on side surfaces forming the opening. Each protrusion has a fifth surface a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes. The base plate has cover portions covering the fifth surfaces, and is plastically deformed to allow the panel to be fitted in the base plate to fill gaps.

Abstract: A honeycomb structure includes a central area and a reinforced outer peripheral area. For a boundary cell having cell walls with different wall thicknesses on two sides parallel with an imaginary parallel line, a thin wall thickness t1<a thick wall thickness t3, an inner wall thickness t2<an outer wall thickness t4, t1=t2, and t3=t4. The honeycomb structure includes a cross-shaped unit having a thin wall, an inner wall, a cell wall, and a cell wall and a cross-shaped unit having a thick wall, an outer wall, a cell wall, and a cell wall. The honeycomb structure also includes cross-shaped units extending vertically and horizontally from alternate cell vertexes arranged from a cell vertex as a starting point. In the central area and the reinforced outer peripheral area, the cell walls of each cross-shaped unit have a substantially equal wall thickness.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A ceramic electronic component includes a ceramic body including an internal electrode therein and at least two external electrodes provided on an outer surface of the ceramic body. The external electrode includes an underlying electrode layer provided on the outer surface of the ceramic body, a first Ni plated layer provided on an outer side of the underlying electrode layer, and a second Ni plated layer provided on an outer side of the first Ni plated layer. Ni oxide is present between the first Ni plated layer and the second Ni plated layer.

Abstract: A honeycomb structure includes a central area and a reinforced outer peripheral area. A reference boundary cell with an inner wall orthogonal to an imaginary straight line, adjacent to the honeycomb center, and thinner than an outer wall adjacent to the honeycomb periphery has a reference wall different in wall thickness from the other three cell walls among the remaining four cell walls excluding the inner wall and the outer wall. The honeycomb structure includes a reference Y-shaped unit having the reference wall, the outer wall, and a cell wall. The honeycomb structure includes a plurality of Y-shaped units extending in the same directions as the reference Y-shaped unit. For every Y-shaped unit in the central area and the reinforced outer peripheral area of the honeycomb structure, the cell walls of each Y-shaped unit has an equal wall thickness.

Abstract: Provided is a speaker unit that constitutes a sound system that reduces noise in an open space, including: a housing; a driver; and a microphone, in which the microphone and the driver are provided in the housing such that sensitivity of the microphone to a signal output from the driver is lower.