Patents by Inventor Kenichi HIRENZAKI

Kenichi HIRENZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and manufacturing method thereof
    Patent number: 11087915
    Abstract: Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 10, 2021
    Assignee: TDK CORPORATION
    Inventors: Masahiro Nakajima, Kenichi Hirenzaki, Makoto Endo, Masanori Suzuki, Tomonaga Nishikawa
  • ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20190066900
    Abstract: Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.
    Type: Application
    Filed: August 10, 2018
    Publication date: February 28, 2019
    Applicant: TDK CORPORATION
    Inventors: Masahiro NAKAJIMA, Kenichi HIRENZAKI, Makoto ENDO, Masanori SUZUKI, Tomonaga NISHIKAWA