Abstract: A high-humidity resistant silicone resin adhesive composition contains: (A) alkenyl group-containing organopolysiloxanes comprising (A1) a linear organopolysiloxane and (A2) a branched organopolysiloxane such that a mass ratio (A1)/(A2) of the (A1) and the (A2) is in a range of 1 to 10; (B) an organohydrogenpolysiloxane; (C) a platinum group metal-based catalyst; (D) a di(meth)acrylate compound; (E) an oligomer of a trimethoxysilane or trichlorosilane hydrolysate, the oligomer having at least three hydrogen atoms directly bonded to silicon atoms per molecule; and (F) an organohydrogenpolysiloxane having epoxy groups. Thus, the present invention provides a high-humidity resistant silicone resin adhesive composition for enabling tolerance in high-temperature high-humidity tests, such as PCT and HAST, conducted at high pressure.

Abstract: One object of the invention is to improve the affinity between the silicone resin and the thermally conductive filler to facilitate mixing thereof. Another object of the invention is to suppress a viscosity increase of a silicone resin composition containing a high level of loading of thermally conductive filler, and to provide a cured product having a higher thermal conductivity. According to the invention, a thermally conductive silicone composition is provided, which comprises (A) an organopolysiloxane having two or more alkenyl groups each bonded to a silicon atom per molecule; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms each bonded to a silicon atom per molecule in such an amount that the molar ratio of the hydrogen atoms each bonded to a silicon atom in component (B) to the alkenyl groups in component (A) is within the range of from 0.

Abstract: One object of the invention is to improve the affinity between the silicone resin and the thermally conductive filler to facilitate mixing thereof. Another object of the invention is to suppress a viscosity increase of a silicone resin composition containing a high level of loading of thermally conductive filler, and to provide a cured product having a higher thermal conductivity. According to the invention, a thermally conductive silicone composition is provided, which comprises (A) an organopolysiloxane having two or more alkenyl groups each bonded to a silicon atom per molecule; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms each bonded to a silicon atom per molecule in such an amount that the molar ratio of the hydrogen atoms each bonded to a silicon atom in component (B) to the alkenyl groups in component (A) is within the range of from 0.

Abstract: A heat-conductive silicone resin composition is provided comprising (A) an alkenyl-containing organopolysiloxane, (B) a SiH-containing organohydrogenpolysiloxane, (C) a heat-conductive filler, (D) a platinum group metal based catalyst, and (E) a thiol or sulfide group-containing organic compound. The composition has a cure onset time at 150° C. of from 10 minutes to less than 30 minutes, as measured by a scanning vibrating needle curemeter. The invention is effective for substantially suppressing unintended thickening or curing during the semiconductor device fabrication process even at a temperature of 150° C. or higher, but the composition is still curable in the desired shape.

Abstract: A cured thin film may be easily prepared, by curing a photocurable silicone resin composition containing: (A) an organopolysiloxane having two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, and (C) a photoactive catalyst, by: (i) applying the composition to a substrate, (ii) obtaining a thin film in a semi-cured state by irradiating the applied coating with light, and (iii) heating the thin film in a semi-cured state to achieve complete curing, wherein the spectrum of the light irradiated in step (ii) has a maximum peak in a wavelength region from 300 nm to 400 nm, and the spectral irradiance of light of any wavelength within the wavelength region shorter than 300 nm is not more than 5% of the spectral irradiance of light of the maximum peak wavelength.

Abstract: A method for curing a silicone resin composition with heat, wherein the silicone resin composition comprises (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxnae having, per molecule, at least two hydrogen atoms each bonded to a silicon atom, and (C) a photoactive catalyst, wherein the method is characterized by comprising a step of irradiating the silicone resin composition with light before a step of heating, the light has a maximum peak of irradiance in a region of wavelengths of 300 to 400 nm and an irradiance of light of wavelength shorter than 300 nm is 5% or less of the irradiance at the maximum peak.