Abstract: A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.

Abstract: A reflective mask blank includes a substrate; a multilayer reflective film that reflects EUV light; a protection film that protects the multilayer reflective film; and a phase shift film that shifts a phase of the EUV light, the substrate, the multilayer reflective film, the protection film, and the phase shift film being arranged in this order. The phase shift film contains at least one first element X1 selected from the first group consisting of ruthenium (Ru), iridium (Ir), platinum (Pt), palladium (Pd), and gold (Au), and at least one second element X2 selected from the second group consisting of oxygen (O), boron (B), carbon (C), and nitrogen (N). In the phase shift film, a chemical shift of a peak of 3d5/2 or a peak of 4f7/2 of the first element X1 observed by X-ray electron spectroscopy is less than 0.3 eV.

Abstract: An approach is provided in which the approach captures a set of individual indices corresponding to a set of psychological conditions of individual members of a team during a set of phases of a project. The approach computes, based on the set of individual indices, a set of team indices corresponding to the set of psychological conditions indicating a team state in each one of the set of phases of the project. The approach transmits a recommendation to a user in response to detecting a set of differences between the set of team indices and a set of expected values. The recommendation includes an action to increase the set of team indices.

Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.

Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.

Abstract: A radiation dosimetry gel is excellent in heat resistance, and a radiation dosimeter includes the radiation dosimetry gel as a material for measuring a radiation dose. A radiation dosimetry gel includes a water-soluble organic polymer (A) having an organic acid salt structure or an organic acid anion structure, a silicate (B), and a dispersant (C) for the silicate, and a radiation dosimeter includes the radiation dosimetry gel as a material for measuring a radiation dose.

Abstract: A radiation dosimetry gel is excellent in heat resistance, and a radiation dosimeter includes the radiation dosimetry gel as a material for measuring a radiation dose. A radiation dosimetry gel includes a water-soluble organic polymer (A) having an organic acid salt structure or an organic acid anion structure, a silicate (B), and a dispersant (C) for the silicate, and a radiation dosimeter includes the radiation dosimetry gel as a material for measuring a radiation dose.

Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

Abstract: A punch constitutes, together with a die, a blanking die for punching a workpiece with a punching shape in which protrusions protrude outwards from an annular body. The punch includes a cylinder-shaped punch section and a holder section. In the punch section, a shape of the front end surface corresponding to the punching shape of the workpiece is continuous to a rear end surface, and includes a cutting edge on its front end surface. The holder section is a short cylinder including an inner circumferential surface formed in correspondence with an outer circumferential surface of the punch section to allow insertion of a rear part of the punch section. The protrusions are brought into intimate contact with the recesses of the holder section. A clearance is provided between a part of the punch section other than the protrusions and a part of the holder section other than the recesses.

Abstract: A punch constitutes, together with a die, a blanking die for punching a workpiece with a punching shape in which protrusions protrude outwards from an annular body. The punch includes a cylinder-shaped punch section and a holder section. In the punch section, a shape of the front end surface corresponding to the punching shape of the workpiece is continuous to a rear end surface, and includes a cutting edge on its front end surface. The holder section is a short cylinder including an inner circumferential surface formed in correspondence with an outer circumferential surface of the punch section to allow insertion of a rear part of the punch section. The protrusions are brought into intimate contact with the recesses of the holder section. A clearance is provided between a part of the punch section other than the protrusions and a part of the holder section other than the recesses.

Abstract: A semiconductor integrated circuit is provided. In the semiconductor integrated circuit, each of ESD protection circuitries is disposed between two of TSV bumps arrayed in a matrix, the two being arranged adjacent to each other. First main power lines are disposed to overlap P-channel ESD protection elements. Second main power lines are disposed to overlap N-channel ESD protection elements. The first and second main power lines are arranged orthogonally to each other.

Abstract: To measure three-dimensional dose distributions with a dosimeter, such as a gel dosimeter. In an embodiment of the present invention, provided is a gel dosimeter having water, as solvent or disperse medium, clay particles that swell with water, and recording material precursor, which are dissolved or dispersed with each other. The recording material precursor has an atom or ion, wherein the atom or ion changes its valence number by reacting with both of a radical and a molecular radical derivative. The radical is to be generated from the water ionized by irradiation of radiation rays, and the molecular radical derivative is a molecule to be formed by bonding the radicals with each other. By the time radiation rays are irradiated, the gel dosimeter has been free from a substance identical to the molecular radical derivative and has lost fluidity.

Abstract: A semiconductor integrated circuit is provided. In the semiconductor integrated circuit, each of ESD protection circuitries is disposed between two of TSV bumps arrayed in a matrix, the two being arranged adjacent to each other. First main power lines are disposed to overlap P-channel ESD protection elements. Second main power lines are disposed to overlap N-channel ESD protection elements. The first and second main power lines are arranged orthogonally to each other.

Abstract: A semiconductor integrated circuit is provided. In the semiconductor integrated circuit, each of ESD protection circuitries is disposed between two of TSV bumps arrayed in a matrix, the two being arranged adjacent to each other. First main power lines are disposed to overlap P-channel ESD protection elements. Second main power lines are disposed to overlap N-channel ESD protection elements. The first and second main power lines are arranged orthogonally to each other.

Abstract: To measure three-dimensional dose distributions with a dosimeter, such as a gel dosimeter. In an embodiment of the present invention, provided is a gel dosimeter having water, as solvent or disperse medium, clay particles that swell with water, and recording material precursor, which are dissolved or dispersed with each other. The recording material precursor has an atom or ion, wherein the atom or ion changes its valence number by reacting with both of a radical and a molecular radical derivative. The radical is to be generated from the water ionized by irradiation of radiation rays, and the molecular radical derivative is a molecule to be formed by bonding the radicals with each other. By the time radiation rays are irradiated, the gel dosimeter has been free from a substance identical to the molecular radical derivative and has lost fluidity.

Abstract: A semiconductor integrated circuit is provided. In the semiconductor integrated circuit, each of ESD protection circuitries is disposed between two of TSV bumps arrayed in a matrix, the two being arranged adjacent to each other. First main power lines are disposed to overlap P-channel ESD protection elements. Second main power lines are disposed to overlap N-channel ESD protection elements. The first and second main power lines are arranged orthogonally to each other.

Abstract: An object of the present invention is to provide an adsorbent suitable as an adsorbent for a canister which is capable of reducing an amount of evaporated fuel gas released into the atmosphere even where a motor vehicle is allowed to park for a prolonged period of time, a process for producing the adsorbent as well as a canister using the adsorbent and a method for using the canister. The above object can be accomplished by an adsorbent in which an integrated volume of pores having an average diameter of 3,000 to 100,000 nm as measured with a mercury porosimeter is 6.5 mL/dl or more and an equilibrium adsorption as measured in an n-butane volume concentration of 2,000 ppm is 0.16 g/dL or more, a process for producing the adsorbent, as well as a canister and a method for using the canister.

Abstract: A semiconductor integrated circuit includes a plurality of bonding pads formed along an edge of a semiconductor substrate; a plurality of I/O cells arranged along the edge under the plurality of bonding pads; an upper layer wire mesh including a plurality of upper layer wirings; and a core region formed on the semiconductor substrate. In the semiconductor integrated circuit, the core region has an area larger than an area occupied by the upper layer wire mesh in a plane parallel to a surface of the semiconductor substrate.

Abstract: An electronic apparatus comprises a housing that contains a heat-generating component, a heat radiating component and a fan that is adapted to apply air to the heat radiating component and including an inlet port and an outlet port. The electronic apparatus further comprises a support member situated within the housing and arranged so that that the outlet port of the fan faces the heat radiating component. Being coupled to the fan and the heat radiating component, the support member comprises an opening portion to direct air to the fan, where the opening portion is aligned with the inlet port of the fan.