Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si—H groups on side chains, (C) an organohydrogenpolysiloxane having an Si—H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Abstract: A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Abstract: A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si—H groups on side chains, (C) an organohydrogenpolysiloxane having an Si—H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Abstract: A method of bonding a heat radiating sheet to the surface of a substrate such as a heat generating electronic component is provided. According to this method, a release sheet, which is coated on one surface with a transferable heat radiating material, is positioned on top of the substrate so that the surface coated with the heat radiating material contacts the substrate, and subsequently, a molding device with a contact surface of a required shape and surface area is positioned so that the contact surface contacts the rear surface of the release sheet positioned on the substrate, and pressure and/or heat is then applied and a heat radiating material layer of the required surface area and shape is transferred from the release sheet to the substrate surface. The heat radiating sheet can be bonded easily to the required section of the substrate surface, without requiring the use of an adhesive, and without requiring any prior processing of the heat radiating sheet.

Abstract: Novel nitrogen atom-containing polysiloxanes having residual alkoxy groups are provided. Compositions comprising the same are effective for treating fibers or fibrous materials for imparting softness and durability of home laundering and preventing yellowing.

Abstract: A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 &mgr;m and coarse metallic aluminum powder having an average particle size of 10 to 40 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.

Abstract: A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.

Abstract: A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Abstract: An organopolysiloxane composition comprising (1) 100 parts by weight of an organopolysiloxane having at least two unsaturated groups per molecule, (2) 0.1-30 parts by weight of a liquid organohydrogenpolysiloxane having at least two hydrogen atoms attached directly to silicon atoms (≡Si—H bonds) per molecule, (3) 0.1-6.0 parts by weight of an addition reaction control agent prepared by mixing (a) an acetylene alcohol and (b) a silylated acetylene alcohol in a (b)/(a) ratio ranging from greater than 5 to no greater than 100 on a weight basis, and (4) a catalytic amount of a platinum metal catalyst.

Abstract: A silicone grease composition having high thermal conductivity, comprising (A) 50 to 95 weight % of a mixture of an aluminum nitride powder &agr; having an average particle size of 0.5 to 5 &mgr;m and an aluminum nitride powder &bgr; having an average particle size of 6 to 20 &mgr;m, wherein the aluminum nitride powders &agr; and &bgr; are mixed so that the &agr;/(&agr;+&bgr;) ratio by weight is from 0.1 to 0.9 and the average particle size after mixing is from 1 to 10 &mgr;m, (B) 5 to 15 weight % of organopolysiloxanes having a viscosity of from 50 to 50,000 cs at 25° C. and represented by formula R1aSiO(4−a)/2, wherein R1 represents at least one group selected from saturated or unsaturated univalent hydrocarbon groups containing 1 to 18 carbon atoms and 1.8≦a≦2.2, and (C) 0 to 35 weight % of at least one inorganic compound powder having an average particle size of 0.5 to 100 &mgr;m selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.

Abstract: A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 &mgr;m and containing no particles 100 &mgr;m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25° C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.

Abstract: An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.

Abstract: A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.

Abstract: A specific amount of a low molecular weight vinyl siloxane is blended with a platinum-vinyl siloxane complex to provide a platinum complex catalyst, which is prevented from deterioration with time at elevated temperatures and from blackening and precipitation, and maintains its catalytic activity unaffected.

Abstract: A solventless curable silicone release composition contains (A) a branched organopolysiloxane having a vinyl group attached to a silicon atom at an end of its molecular chain, (B) an organohydrogenpolysiloxane having at least three SiH groups in a molecule, and (C) a platinum group metal catalyst. The composition is easily applicable to a thin gage and cures into a releasable silicone coating ensuring light release at high speeds. A release sheet having the cured coating formed thereon has improved release characteristics.

Abstract: A water soluble water absorption preventing agent mainly comprising an organic silicon compound and/or its partial hydrolytic condensate, represented by the following general formula: ##STR1## wherein R.sup.1 denotes an alkyl group with 1-20 carbon atoms and with a linear chain or branched chain for which a halogen can substitute for part or all of the hydrogen atoms, R.sup.2 denotes a hydrogen atom or an alkyl group with 1-10 carbon atoms and with a linear chain or branched chain, R.sup.3 denotes a hydrogen atom or an alkyl group with 1-8 carbon atoms and with a linear chain or branched chain, m denotes an integer 1-2 and n denotes an integer 1-3 where m+n=3 or 4, p denotes an integer 1-50, and q denotes an integer 0-25.

Abstract: There is provided a curable organopolysiloxane composition comprising (A) an organopolysiloxane containing, in its molecule, at least two groups represented by the general formula (1):CH.sub.2 .dbd.CH--(CH.sub.2).sub.a --(OC.sub.b H.sub.2b).sub.c --O--(1)wherein a is an integer of 1 to 8, b is an integer of 2 to 4, and c is an integer of 0 to 3; (B) an organohydrogenpolysiloxane containing, in its molecule, at least two hydrogen atoms each bonded to a silicon atom; (C) an addition-reaction retarder; and (D) a platinum family metal catalyst. The composition is fast in curing speed and superior in curing stability.

Abstract: Disclosed is a water repellent for fibers, comprising an acryl-silicone graft copolymer which is prepared by a radical copolymerization reaction of an organopolysiloxane compound containing one radical polymerizable group with radical polymerizable monomers including an acrylate, a methacrylate or a mixture thereof as a main member.