Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.

Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A common mode choke coil array of a two-element type includes two common mode choke coil elements including at least two spiral coils and arranged side by side in a laminate body (chip member) in plan view. The spiral coils are configured so that the number of turns of the coils on the sides thereof where the coils are adjacent to each other is smaller than the number of turns of the coils on the sides thereof where the coils are distant from each other. The spiral directions of the coils arranged side by side are opposite to each other.

Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

Abstract: A common mode choke coil array of a two-element type includes two common mode choke coil elements including at least two spiral coils and arranged side by side in a laminate body (chip member) in plan view. The spiral coils are configured so that the number of turns of the coils on the sides thereof where the coils are adjacent to each other is smaller than the number of turns of the coils on the sides thereof where the coils are distant from each other. The spiral directions of the coils arranged side by side are opposite to each other.

Abstract: A discharge control circuit is connected between an output signal line of a boot-strap circuit having an allowable output signal voltage level range and a low voltage line. If an output signal voltage level of the output signal line is within the allowable output signal voltage level range, then the discharge control circuit provides no electrical connection between the output signal line and the low voltage line and if the output signal voltage level of the output signal line exceeds the allowable output signal voltage level range, then the discharge control circuit provides an electrical connection between the output signal line and the low voltage line.

Abstract: A lumbar support device to provided on a seat back frame of a vehicle seat. In this device, a crank-like torsion bar is rotatably secured on the seat back frame via a cramp member having a snap action element, and connected at its one end to a lanced bridge integral with a lumbar plate, without requiring any separate connecting element. Another end of the torsion is abutted on an adjustment cam which is also directly mounted in a cam support bracket, without any separate connecting element, the cam support bracket being fixed on the seat back frame. Additionally, removal prevention elements are integrally provided at connecting points among those torsion bar, cramp member, lumbar plate, cam and cam support bracket, in order to prevent them against removal from one another. Therefore, the number of constituent elements can be reduced and assembling of the lumbar support device may be expedited with great ease.

Abstract: A suspension device for a vehicle seat, which comprises an upper frame, a lower frame, an X-shaped link interposed between the upper and lower frames, a vertically active elastic element for resiliently supporting the X-shaped link in the vertical direction, a slide frame, and a fore-and-aft active elastic element for resiliently supporting the slide frame in the forward and backward directions. The slide frame is connected with one end of the X-shaped link, so that the suspension device is not only active vertically for giving elasticity to the vertical motion of X-shaped link, but also active for allowing fore-and-aft resilient movement of the upper frame.

Abstract: A structure of a vehicle seat with a height adjuster, with a side cover attached laterally of a seat cushion of the seat, in which a side covering member is provided at one side of the seat cushion where the side cover exists in such a manner as to be disposed in a clearance between the side cover and side wall of the seat cushion. Even when the seat cushion is raised to a highest level by operation of the height adjuster, the side covering member still covers the clearance to thereby prevent an objectionable interior under the seat cushion from being exposed to view. Provision of an auxiliary frame around a forward half portion of seat cushion frame adds to the effect of such exposure prevention in cooperation with the side covering member, which also prevents the exposure from being viewed from forward side of the seat cushion.