Patents by Inventor Kenichi Iwakura

Kenichi Iwakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus, device management controller, and recording medium
    Patent number: 11966210
    Abstract: A substrate processing apparatus includes a device management controller including a parts management control part configured to monitor the state of parts constituting the apparatus, a device state monitoring control part configured to monitor integrity of device data obtained from an operation state of the parts constituting the apparatus, and a data matching control part configured to monitor facility data provided from a factory facility to the apparatus. The device management controller is configured to derive information evaluating the operation state of the apparatus based on a plurality of monitoring result data selected from a group consisting of maintenance timing monitoring result data acquired by the parts management control part, device state monitoring result data acquired by the device state monitoring control part, and utility monitoring result data acquired by the data matching control part.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: April 23, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Kazuhide Asai, Kazuyoshi Yamamoto, Hidemoto Hayashihara, Takayuki Kawagishi, Kayoko Yashiki, Yukio Miyata, Hiroyuki Iwakura, Masanori Okuno, Kenichi Fujimoto, Ryuichi Kaji
  • Touch sensor unit of prober for testing electric circuit and electric circuit testing apparatus using the touch sensor unit
    Patent number: 5315237
    Abstract: A touch sensing unit has an ac signal generator for supplying an ac signal to a semiconductor chip of a semiconductor wafer or a test probe needle, and a touch sensor for sensing formation of an ac signal loop passing an ac signal of the signal generator when the test probe needle and the IC chip are touched with each other by being relatively approached to each other.
    Type: Grant
    Filed: August 6, 1991
    Date of Patent: May 24, 1994
    Assignee: Tokyo Electron Limited
    Inventors: Kenichi Iwakura, Tetsuo Ohtsuka