Abstract: An agricultural or horticultural composition is provided. A composition containing a culture broth of a Bacillus bacterium having prephenate dehydratase (PD) resistant to feedback inhibition by phenylalanine.

Abstract: A component mounting method of mounting a component onto a board by a component mounting apparatus which includes a transportation device having a plurality of rails capable of transporting a plurality of boards in parallel is provided. The method includes positioning the rails so that a center of a mounting area in a forward-backward direction is at an intermediate position between corresponding parts of two component supply units, the mounting area covering an area in which two mounting heads mount components on one or more of the boards which are transported by the transportation device, and the intermediate position being equally distant in the forward-backward direction from the two component supply units; and alternately mounting the components in the mounting area between the two mounting heads.

Abstract: A challenge to be met by the invention is to provide an electronic component mounting machine that makes up an electronic component mounting line and that standardizes an operation input method, to thus enable lessening of work load on an operator during performance of operation input action, and an operation instruction method for use with the electronic component mounting machine. In electronic component mounting machines that make it possible for a single machine to perform a plurality of types of works by replacement of a work head to be built into a common platform according to a type of work, a production start button to a model change button are provided as common individual input parts in a basic operation command input part of a display panel of an operation unit regardless of a work type.

Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.

Abstract: It is an objective to provide a part-mounting method that, even when parts are extremely small, makes it possible to mount the parts at a repair-requiring location without fail, to thus enhance a percentage of a non-defective substrate. In a part-mounting method, inspection is made as to whether or not a parts-missing location exists on a substrate Pb reloaded between a solder printer 2 and a first part-mounting machine 4A after having undergone manual repair by an operator OP, or the like, in connection with a repair-requiring location found through inspection performed after mounting of parts Pt, by use of an inspection camera 15A of a first part-mounting machine 4A. When a parts-missing location on the substrate Pb is found, the parts-missing location is identified. Subsequently, a mounting head 14A of the first part-mounting machine 4A and a mounting head 14B of a second part-mounting machine 4B mount a part Pt at the parts-missing location on the thus-identified substrate Pb.

Abstract: A mount state of components is inspected in a mounting apparatus 1b at total two divisions of a component mounting division b where the mounting apparatus 1b performs mounting and a component mounting division a where a mounting apparatus 1a disposed on an upstream side performs the mounting; the mount state of components is inspected in a mounting apparatus 1c at total three divisions of a component mounting division c where the mounting apparatus 1c performs the mounting and the component mounting divisions a and b where the mounting apparatus 1a and 1b disposed on the upstream side perform the mounting; and the mount state of components is inspected in a mounting apparatus 1d at total four divisions of a component mounting division d where the mounting apparatus 1d performs the mounting and the component mounting divisions a, b, and c where the mounting apparatus 1a, 1b, and 1c disposed on the upstream side perform the mounting.

Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.

Abstract: It is an objective to provide a part-mounting system and a part-mounting method that, even when parts are extremely small, make it possible to mount the parts at a repair-requiring location without fail, to thus enhance a percentage of a non-defective substrate. In a part-mounting system 1, inspection is made as to whether or not a parts-missing location exists on a substrate Pb reloaded between a solder printer 2 and a first part-mounting machine 4A after having undergone manual repair by an operator OP, or the like, in connection with a repair-requiring location found through inspection performed after mounting of parts Pt, by use of an inspection camera 15A of a first part-mounting machine 4A. When a parts-missing location on the substrate Pb is found, the parts-missing location is identified. Subsequently, a mounting head 14A of the first part-mounting machine 4A and a mounting head 14B of a second part-mounting machine 4B mount a part Pt at the parts-missing location on the thus-identified substrate Pb.

Abstract: It is an objective to provide a part-mounting system that makes it possible to quickly ascertain a defective judgment location and input a result of judgment of the defective judgment location even if an operator is away from an inspection portion when the inspection portion has found a defective judgment location. An image of a location on a substrate Pb where a print status of solder Sd or a mounted status of parts Pt is judged as being defective by an inspection portion is displayed on all image display portions 31 of a plurality of operation panels 30 or some of the image display portions 31 selected by an operator OP. Through an operation input portion 32 of the operation panel 30 including the image display portion 31 on which the image of the defective judgment location is displayed, the operator OP can input a result of judgment made as to whether or not the print status of the solder Sd or the mounted status of the parts Pt at the defective judgment location is defective.

Abstract: A component mounting method of mounting a component onto a board by a component mounting apparatus (200) which includes a transportation device (220) having a plurality of rails capable of transporting a plurality of boards in parallel, and the method includes: positioning the rails (S108 to S112) so that a center of a mounting area in a forward-backward direction is at an intermediate position between two component supply units (211a, 211b), the mounting area covering an area in which two mounting heads (213a, 213b) mount components on one or more of the boards which are transported by the transportation device (220), and the intermediate position being equally distant in the forward-backward direction from the two mounting supply units (211a, 211b); and alternately mounting (S114) the components in the mounting area by the two mounting heads (213a, 213b).

Abstract: A challenge to be met by the invention is to provide an electronic component mounting machine that makes up an electronic component mounting line and that standardizes an operation input method, to thus enable lessening of work load on an operator during performance of operation input action, and an operation instruction method for use with the electronic component mounting machine. In electronic component mounting machines that make it possible for a single machine to perform a plurality of types of works by replacement of a work head to be built into a common platform according to a type of work, a production start button (42a) to a model change button (42d) are provided as common individual input parts in a basic operation command input part (42) of a display panel (4a) of an operation unit regardless of a work type.

Abstract: A component mount system includes: a component placing unit; an inspection unit; a repair station; an image display device; a defective portion image display unit configured to display an image of a defective portion of a board on the image display device; an input device; and a repair required portion display unit configured to display a defective portion detected by the inspection unit, which is indicated as a true defective portion in a determination result input through the input device and selected from the defective portion detected by the inspection unit, as a repair required portion on the image display device. The image display device is provided at a location where an operator who performs a repair work can watch the image displayed on the image display device, and the input device is provided at a location where the operator can operate the input device.

Abstract: An inspection process before component mounting for all component mounting positions on which components are to be mounted is performed when a reenter mode is not set by operation of a reenter switch, a recognition camera is first caused to recognize the component mounting position and then a component presence inspection process which inspects whether or not the component is mounted on the component mounting position is performed when the reenter mode is set by the reenter switch, and, the inspection process before component mounting is performed for the component mounting position on which the component is not mounted.

Abstract: A mount state of components is inspected in a mounting apparatus 1b at total two divisions of a component mounting division b where the mounting apparatus 1b performs mounting and a component mounting division a where a mounting apparatus 1a disposed on an upstream side performs the mounting; the mount state of components is inspected in a mounting apparatus 1c at total three divisions of a component mounting division c where the mounting apparatus 1c performs the mounting and the component mounting divisions a and b where the mounting apparatus 1a and 1b disposed on the upstream side perform the mounting; and the mount state of components is inspected in a mounting apparatus 1d at total four divisions of a component mounting division d where the mounting apparatus 1d performs the mounting and the component mounting divisions a, b, and c where the mounting apparatus 1a, 1b, and 1c disposed on the upstream side perform the mounting.

Abstract: A method for inspection of circuit boards is described which includes: a process of measuring surface-shape data of a circuit board on which inspection objects are placed; an approximated curved surface generation process for generating an approximated curved surface from the measured surface-shape data, which is an estimated surface-shape of the circuit board, on which no inspection object is placed; a process of subtracting said approximated curved surface from the measured surface-shape data; a region of interest determination process of determining regions which are different from the approximated curved surface in accordance with data obtained by said subtraction process; and a process of inspecting whether electronic parts placed on said circuit board and connecting materials for connecting the electronic parts are in a desired state or not.

Abstract: Based on the result of a teaching operation for recognizing and examining a subject component in an image processing apparatus, there is created teaching data containing data specific to an image processing apparatus that executed the teaching operation, and the teaching data is electronically distributed to image processing apparatus other than the image processing apparatus that executed teaching to enable use of the teaching data for image-processing in other image processing apparatus.

Abstract: The present invention is to propose a circuit board inspection method and its apparatus in which extraction of all of minute parts placed on a circuit board is possible without being influenced by an amount of deformation of the circuit board; according to the present invention, the method for inspecting the circuit board comprises a step of measuring a 3-dimensional shape of the circuit board which is an inspection object and making it to be a surface-shape measurement data, a step of automatically estimating the amount of deformation of the circuit board from measured surface-shape measurement data of whole of the surface of the circuit board, a step of automatically generating an approximated curved surface of the circuit board from an estimated result of the above-mention step, and a step of performing a subtraction process between the approximated curved surface generated in the abovementioned step and the surface-shape measurement data; the apparatus for inspecting the circuit board comprises processing

Abstract: An inspection apparatus for inspecting printed circuit boards on which components have been mounted, wherein a light source that generates a light beam in a concentrated spot fashion is mounted on a rotary object and radiates the beam spot onto the printed circuit board at approximately right angles thereto while the rotary object is rotating, so that the surface of the printed circuit board is scanned by the beam spot. Changes of at least either one of the reflection angle and the intensity of the light reflected from the printed circuit board is detected by photoelectric converters provided on the rotary object, and at least either one of the height and the brightness of the position at which the beam spot and the printed circuit board are intersected is measured, thereby performing the inspection of the printed circuit board.