Patents by Inventor Kenichi Kawabata

Kenichi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7496326
    Abstract: An electrostatic attraction device is disclosed that attracts and transports a recording medium by applying an electric field to a surface of an endless belt member with use of a charger while rotating the belt member. The electrostatic attraction device comprises a separation claw holding unit separately provided from the charger.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: February 24, 2009
    Assignee: Ricoh Company, Ltd
    Inventor: Kenichi Kawabata
  • Publication number: 20090048516
    Abstract: An diagnostic imaging apparatus for imaging information changing with time and displaying it in real time, composed of an ultrasonic probe (2), having piezoelectric elements arranged in an array form that transmit ultrasonic waves to a target object (1) and acquires a reflection signal from the target object; a body movement measuring unit (12) that constitutes a two-dimensional ultrasonic image using the reflection signal acquired by the ultrasonic probe, sets, in the image plane, a plurality of measuring areas used for measuring the body movement of the target object, and measures the body movement and deformation amounts in the measuring areas; and an image accumulating (subtracting) unit for accumulating or subtracting images using body movement measured by the body movement measurement unit.
    Type: Application
    Filed: May 18, 2006
    Publication date: February 19, 2009
    Inventors: Hideki Yoshikawa, Takashi Azuma, Kenichi Kawabata, Kazuaki Sasaki, Shinichiro Umemura
  • Publication number: 20090025965
    Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).
    Type: Application
    Filed: July 21, 2008
    Publication date: January 29, 2009
    Applicant: TDK CORPORATION
    Inventors: Yoshikazu Kanemaru, Kenichi Kawabata
  • Publication number: 20090025971
    Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): ?1<?3 and ?2<?3 . . . (1), is mounted on an unmounted portion of the electronic component 41 on the substrate 11. In the formula, ?1, ?2 and ?3 respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component 41, the plate-like frame member 51, and the substrate 11, the respective wiring layers or the respective insulating layers.
    Type: Application
    Filed: July 21, 2008
    Publication date: January 29, 2009
    Applicant: TDK CORPORATION
    Inventors: Yoshikazu Kanemaru, Takaaki Morita, Kenichi Kawabata
  • Publication number: 20090025961
    Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.
    Type: Application
    Filed: July 21, 2008
    Publication date: January 29, 2009
    Applicant: TDK CORPORATION
    Inventors: Yoshikazu Kanemaru, Hiroshige Ohkawa, Kenichi Kawabata
  • Publication number: 20090015621
    Abstract: An image forming apparatus includes a recording head, a water-repellent transfer belt, a pattern formation controller, a read unit, and a detection unit. The recording head has a plurality of nozzles aligned in a given direction, and ejects droplets of a liquid therefrom. The pattern formation controller directs each of the plurality of nozzles to eject the liquid to form a detection pattern on the transfer belt. The detection pattern has multiple droplets ejected from each of the plurality of nozzles sequentially arranged and spaced apart from each other both in the given direction and in a direction orthogonal to the given direction. The read unit includes a light emitting element and a light receiving element, and reads the detection pattern to output a read result. The detection unit detects a defective nozzle according to the read result.
    Type: Application
    Filed: June 30, 2008
    Publication date: January 15, 2009
    Inventors: Tetsuro Hirota, Takumi Hagiwara, Kenichi Kawabata, Mamoru Yorimoto, Tetsu Morino, Noboru Sawayama
  • Publication number: 20090010852
    Abstract: Provided are a preparation process of a diagnostic or therapeutic agent having a step of adding, to a first fine emulsion having a particle size of 0.5 ?m or less prepared by applying a predetermined pressure to a first mixture containing a first hydrophobic compound, an emulsifying agent, and an aqueous phase, a second hydrophobic compound compatible with the first hydrophobic compound, thereby preparing a second mixture; and a step of stirring and shaking the second mixture in a hermetically sealed state, thereby embedding the second hydrophobic compound in the first fine emulsion to prepare a second fine emulsion having a particle size of 0.5 ?m or less; a diagnostic or therapeutic agent prepared by the process; and an apparatus for carrying out the process.
    Type: Application
    Filed: June 27, 2008
    Publication date: January 8, 2009
    Inventors: Rei ASAMI, Kenichi Kawabata
  • Publication number: 20080311046
    Abstract: An ultrasound contrast agent composed of at least one kind of low-boiling water-insoluble substance (with a boiling point lower than 37° C.) and at least one kind of high-boiling water-insoluble substance (with a boiling point higher than 37° C.). The former vaporizes to absorb ultrasonic energy upon application of ultrasound, thereby causing the latter to vaporize secondarily, with the resulting bubbles producing an echo image. It is less liable to bumping and hence safe.
    Type: Application
    Filed: August 4, 2005
    Publication date: December 18, 2008
    Inventors: Kenichi Kawabata, Nami Sugita, Shin-ichiro Umemura
  • Publication number: 20080312535
    Abstract: The present invention aims to provide a tissue-function measurement device and a therapeutic device which are not dependent on tissue shape. According to the present invention, the stiffness of a tissue is measured by using, as an index, acoustic variation during the generation of microbubbles from phase-change nano droplets. The acoustic variation is, for example, a duration time of the generation of a harmonic.
    Type: Application
    Filed: May 6, 2008
    Publication date: December 18, 2008
    Inventor: Kenichi Kawabata
  • Publication number: 20080231649
    Abstract: A disclosed image forming apparatus for forming an image on a recording medium being conveyed includes: a recording head discharging droplets; a pattern forming unit forming an adjustment pattern for detecting displacement of landing positions of droplets on a water-repellent member, the adjustment pattern including a minimum block pattern for each detection item and being formed with plural droplets independent of one another; a reading unit including a light emitting unit projecting a light onto the adjustment pattern and a light receiving unit receiving a regular reflection light from the adjustment pattern; and a landing position correcting unit correcting the landing positions of the droplets discharged from the recording head based on a result of reading by the reading unit.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 25, 2008
    Inventors: Kenichi KAWABATA, Noboru Sawayama, Tetsuro Hirota, Mamoru Yorimoto, Tetsu Morino, Takumi Hagiwara
  • Publication number: 20080225067
    Abstract: An image forming apparatus is provided with a carriage in which recording heads having nozzles for ejecting liquid droplets are mounted and is configured to form an image on a recording medium being transported. The image forming apparatus includes a pattern forming unit that forms an impact position displacement adjustment pattern formed of plural independent liquid droplets on a water repellent member; a reading unit that includes a light emitting unit for emitting light onto the adjustment pattern and a light receiving unit for receiving specular reflection light from the adjustment pattern; and an impact position correcting unit that corrects an impact position of a liquid droplet to be ejected from the recording head based on a read result by the reading unit. The reading unit is disposed on the carriage and is arranged close to the side of a guide member that guides movement of the carriage.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Applicant: Ricoh Company, Ltd.
    Inventors: Tetsu MORINO, Noboru Sawayama, Kenichi Kawabata, Mamoru Yorimoto, Tetsuro Hirota, Takumi Hagiwara
  • Publication number: 20080225066
    Abstract: An adjustment pattern, which is composed of a reference pattern made of plural independent liquid droplets and a pattern to be measured made of plural independent liquid droplets ejected under an ejection condition different from the reference pattern, is formed on a water-repellent conveying belt. Then, light is applied to the adjustment pattern to receive the regular reflection light from the adjustment pattern, so that the adjustment pattern is scanned. The distance between the respective patterns is measured based on the measured result. Finally, liquid droplet ejection timing of the recording head is corrected based on the result thus measured.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Applicant: Ricoh Company, Ltd.
    Inventors: Mamoru YORIMOTO, Noboru Sawayama, Kenichi Kawabata, Tetsu Morino, Tetsuro Hirota, Takumi Hagiwara
  • Publication number: 20080225068
    Abstract: A disclosed liquid-jet device includes a liquid-jet head configured to jet liquid droplets; a pattern formation control unit configured to control the liquid-jet head and thereby to form a test pattern composed of separate liquid droplets on a water-repellent part; a detecting unit including a light-emitting element configured to illuminate the test pattern on the water-repellent part and a light-receiving element configured to receive specularly reflected light from the illuminated test pattern and to output a detection signal proportional to the received specularly reflected light; and a landing position adjusting unit configured to adjust landing positions of the liquid droplets based on the detection signal from the light-receiving element.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Applicant: Ricoh Company, Ltd.
    Inventors: Tetsu MORINO, Noboru Sawayama, Kenichi Kawabata, Mamoru Yorimoto, Tetsuro Hirota, Takumi Hagiwara, Masatoshi Sakakitani
  • Publication number: 20080225098
    Abstract: A disclosed image forming apparatus includes a recording head configured to jet liquid droplets; a pattern forming unit configured to form, on a water-repellent surface of a water-repellent sheet member, an adjustment pattern used for correcting shifts in landing positions of the liquid droplets, wherein the adjustment pattern includes plural liquid droplets that are separated from each other, and the water-repellent surface having a water-repellent property is formed on at least a part of a surface of the water-repellent sheet member; a reading unit including a light emitting unit configured to irradiate light onto the adjustment pattern and a light receiving unit configured to receive specular reflection light from the adjustment pattern; and a landing position correction unit configured to correct, based on a reading result obtained by the reading unit, the shifts in the landing positions of the liquid droplets that are jetted from the recording head.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Inventors: Takumi HAGIWARA, Noboru Sawayama, Kenichi Kawabata, Mamoru Yorimoto, Tetsuro Hirota, Tetsu Morino
  • Publication number: 20080202803
    Abstract: There is disclosed a wiring structure or the like capable of sufficiently improving a connection property between a body to be wired and a wiring pattern (layer) connected to the body to be wired. In a semiconductor-embedded substrate 1, conductive patterns 13 are formed on opposite surfaces of a core substrate 11, and a semiconductor device 14 is arranged in a resin layer 16 laminated on the core substrate 11. The resin layer 16 is provided with the conductive pattern 13 and bumps 14p of the semiconductor device 14, and via-holes 19a, 19b are formed through upper portions of the resin layer. In the via-holes 19a, 19b, via-hole electrode portions 23a, 23b are connected to the conductive pattern 13 and the bumps 14p of the semiconductor device 14.
    Type: Application
    Filed: January 16, 2008
    Publication date: August 28, 2008
    Applicant: TDK CORPORATION
    Inventors: Kenji NAGASE, Kenichi KAWABATA
  • Publication number: 20080208054
    Abstract: An ultrasonic imaging apparatus, detecting a signal peculiar to a contrast agent emitted when liquid formed in a fine particle vaporizes due to ultrasonic waves and imaging space distribution thereof. A narrow band is used for transmission, a broad band is used for a received signal, and in a state of high space resolution of the received signal, a transmission signal and the received signal are discriminated.
    Type: Application
    Filed: November 29, 2007
    Publication date: August 28, 2008
    Inventors: Takashi Azuma, Kenichi Kawabata
  • Patent number: 7404797
    Abstract: The present invention provides an ultrasonic imaging system capable of extracting structure-emphasized image data in which the structure of a tissue in a living body is emphasized and texture-emphasized image data in which a texture pattern coming from properties of a tissue in a living body is emphasized from B-mode image data, and obtaining a synthesized image obtained by weighting and combining the two extracted image data pieces.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: July 29, 2008
    Assignee: Hitachi Medical Corporation
    Inventors: Takashi Azuma, Shinichiro Umemura, Tatsuya Hayashi, Kenichi Kawabata, Akiko Osada
  • Publication number: 20080149379
    Abstract: Provided is a wiring structure and the like which can completely connect a wiring layer to a body to be wired while keeping insulation between two adjacent wiring layers and realize high density packaging due to a narrowed pitch. In a semiconductor-embedded substrate, a conductive pattern is formed on both sides of a core substrate and a semiconductor device is placed in a resin layer stacked over the core substrate. The resin layer has via-holes so that the conductive pattern and a bump of the semiconductor device protrude from the resin layer. Inside the via-holes, the bump and conductive pattern are respectively connected to via-hole electrode portions whose cross-sectional area has been increased toward the bottom of the via-hole. A void is defined between the via-hole electrode portion and upper portion of the inner wall of the via-hole.
    Type: Application
    Filed: November 28, 2007
    Publication date: June 26, 2008
    Applicant: TDK CORPORATION
    Inventors: Kenji Nagase, Kenichi Kawabata
  • Patent number: 7372760
    Abstract: A semiconductor device includes a first power supply terminal, a second power supply terminal, a comparison circuit coupled to the first power supply terminal and the second power supply terminal to produce at an output node thereof a signal responsive to a difference between a potential of the first power supply terminal and a potential of the second power supply terminal, and a core circuit coupled to the output node of the comparison circuit to perform a test operation in response to the signal.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: May 13, 2008
    Assignee: Fujitsu Limited
    Inventors: Yoshiaki Nagatomi, Kenichi Kawabata, Norihiro Nakatsuhama, Tetsuya Yoshida, Naoya Watanabe, Tomohiro Wada, Tomohide Yamamoto
  • Publication number: 20080079146
    Abstract: A semiconductor-embedded substrate device according to the present invention can relax a thermal stress during fabrication or use and therefore has sufficient heat radiation properties and reliability. A semiconductor-embedded substrate (100) is a multilayer substrate obtained by stacking resin layers and has, inside of the resin layer (2), a semiconductor device (30) having a bump (32) connected to a terminal electrode (11) via an internal wiring (13) and connection plug (12). A heat radiation member (20) having an opening P in which one or more openings H have been formed is arranged immediately above and opposite to the back surface (30b) of the semiconductor device (30) and heat generated therein is transferred to and released from the heat radiation member (20).
    Type: Application
    Filed: September 24, 2007
    Publication date: April 3, 2008
    Applicant: TDK CORPORATION
    Inventors: Yasuyuki Hattori, Toshikazu Endo, Masashi Katsumata, Takaaki Morita, Kenichi Kawabata