Abstract: A semiconductor device includes: a first semiconductor element including a first face and a second face; a second semiconductor element including a third face and a fourth face; an insulating base member including a fifth face and a sixth face; a first wiring that penetrates through the insulating base member, and is disposed on the sixth face; a second wiring that penetrates through the insulating base member, and is disposed on the sixth face; a first wiring member that faces the second face; and a second wiring member that faces the sixth face, and is electrically connected to the second wiring. The second wiring member is bonded to the first and second wirings while the insulating base member is folded. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.

Abstract: A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member adhesively bonded to the first semiconductor element; a first wiring connected to a first electrode of the first semiconductor element, and disposed on the first insulating base member; a second insulating base member adhesively bonded to the second semiconductor element, a second wiring connected to a third electrode of the second semiconductor element, and disposed on the second insulating base member; a first wiring member connected to a second electrode of the first semiconductor element; a second wiring member electrically connected to the first wiring and a fourth electrode of the second semiconductor element; and a third wiring member connected to the second wiring. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the third wiring member.

Abstract: A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member including a fifth face and a sixth face; a second insulating base member including a seventh face and an eighth face; a first wiring that penetrates through the first insulating base member, and disposed on the sixth face; a second wiring that penetrates through the second insulating base member, and disposed on the eighth face; a first wiring member that faces the second face of the first semiconductor element; and a second wiring member that is provided on the second wiring. The first wiring member is provided on the seventh face of the second insulating base member. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.

Abstract: A filter element structure 100 attached to a backwash type filter W and filtering fluid flowing within the filter includes a pair of one and the other filter elements 10, and a connection pipe 13 connecting the one filter element 10 and the other filter element 10. Each of the filter elements 10 includes a filter medium 11 formed into a hollow cylindrical shape having open ends on both sides, an upper cover 12 covering the upper end of the filter medium 11, and an upper hole 12a penetrating the upper cover 12. One end of the connection pipe 13 is connected with the one upper hole 12a, while the other end of the connection pipe 13 is connected with the other upper hole 12a.