Patents by Inventor Kenichi KOMOTO

Kenichi KOMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11643573
    Abstract: The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: May 9, 2023
    Assignee: FUJIMI INCORPORATED
    Inventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
  • Patent number: 11377627
    Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria. The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: July 5, 2022
    Assignee: FUJIMI INCORPORATED
    Inventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
  • Patent number: 11339310
    Abstract: The present invention provides a polishing composition having a high polishing speed and a low etching speed and capable of achieving sufficient flattening. The present invention is a polishing composition containing abrasive grains, an oxidizing agent, an acid, an anticorrosive containing a compound represented by the following formula (1) or a salt thereof, and a dispersing medium. (In the formula (1), R1 is a linear or branched alkyl group having 6 or more and 30 or less carbon atoms or a linear or branched alkenyl group having 6 or more and 30 or less carbon atoms, R2 is a single bond or an alkylene group having 1 or more and 4 or less carbon atoms, and R3 is a hydrogen atom or a linear or branched alkyl group having 1 or more and 10 or less carbon atoms.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: May 24, 2022
    Inventors: Shogo Onishi, Yukari Uehara, Kenichi Komoto
  • Publication number: 20210139739
    Abstract: The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.
    Type: Application
    Filed: January 23, 2018
    Publication date: May 13, 2021
    Applicant: FUJIMI INCORPORATED
    Inventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
  • Publication number: 20210130751
    Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria. The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.
    Type: Application
    Filed: January 23, 2018
    Publication date: May 6, 2021
    Applicant: FUJIMI INCORPORATED
    Inventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
  • Patent number: 10858615
    Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: December 8, 2020
    Assignee: FUJIMI INCORPORATED
    Inventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
  • Publication number: 20200062997
    Abstract: The present invention provides a polishing composition having a high polishing speed and a low etching speed and capable of achieving sufficient flattening. The present invention is a polishing composition containing abrasive grains, an oxidizing agent, an acid, an anticorrosive containing a compound represented by the following formula (1) or a salt thereof, and a dispersing medium. (In the formula (1), R2 is a linear or branched alkyl group having 6 or more and 30 or less carbon atoms or a linear or branched alkenyl group having 6 or more and 30 or less carbon atoms, R2 is a single bond or an alkylene group having 1 or more and 4 or less carbon atoms, and R3 is a hydrogen atom or a linear or branched alkyl group having 1 or more and 10 or less carbon atoms.
    Type: Application
    Filed: March 9, 2018
    Publication date: February 27, 2020
    Applicant: FUJIMI INCORPORATED
    Inventors: Shogo Onishi, Yukari Uehara, Kenichi Komoto
  • Publication number: 20190300821
    Abstract: The present invention relates to a surface treatment composition including: at least one water-soluble polymer selected from the following Group A; at least one anionic surfactant selected from the following Group B; and water. Group A: water-soluble polysaccharides, polyvinyl alcohols and derivatives thereof, and polyvinylpyrrolidones and derivatives thereof (with the proviso that compounds included in the following Group B are excluded) Group B: compounds having a sulfonic acid (salt) group, compounds having a sulfuric acid ester (salt) group, compounds having a phosphonic acid (salt) group, compounds having a phosphoric acid (salt) group, and compounds having a phosphinic acid (salt) group. According to the present invention, a surface treatment composition capable of efficiently removing foreign bodies, such as particles and organic residues, remaining on the surface of an object to be polished after polishing is provided.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 3, 2019
    Applicant: FUJIMI INCORPORATED
    Inventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
  • Publication number: 20190093051
    Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Applicant: FUJIMI INCORPORATED
    Inventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO