Abstract: Here is provided a method of producing a starch gel-containing food, the method comprising the steps of: treating starch granules with an enzyme at a temperature of about 10° C. or higher and about 70° C. or lower to obtain an enzyme-treated starch; mixing a food material, the enzyme-treated starch and water to obtain a mixture; heating the mixture thereby gelatinizing the enzyme-treated starch in the mixture; and cooling the mixture containing the gelatinized enzyme-treated starch thereby gelling the starch to obtain a starch gel-containing food, wherein the enzyme is selected from the group consisting of amyloglucosidase, isoamylase, ?-glucosidase, ?-amylase having a characteristic capable of improving a gel forming ability of a starch, and cyclodextrin glucanotransferase.

Abstract: A method for manufacturing a light-emitting device, the method comprising: a frame formation step of forming a frame such that a height from a surface of a terminal to which a wire is connected to an upper rim of the frame is smaller than a height from a top surface of a light-emitting element to the upper rim of the frame; a bump formation step of forming a bump on an electrode of the light-emitting element to which the wire is connected; a first bonding step of bonding, first, one end of the wire to the terminal; a second bonding step of bonding, subsequently, the other end of the wire to the bump; and a sealing step of sealing the light-emitting element by filling a sealing material inside the frame.

Abstract: An LED classification device (21) classifies LEDs, the LEDs each including a combination of an LED element that emits a primary light and a phosphor that, upon excitation by the primary light, emits a secondary light having a longer wavelength than the primary light, the LEDs each emitting a combined light of the primary light and the secondary light, those ones of the LEDs whose primary lights having their chromaticities falling within a predetermined chromaticity range being classified as LEDs for use in a backlight of a liquid crystal display apparatus. A coefficient calculating section (26) and a corrected chromaticity calculating section (27) calculate, for all of the LEDs to be classified, correction values for the chromaticities as obtained on the assumption that the primary lights have traveled through a color filter of the liquid crystal display apparatus, and correct chromaticities by subtracting the correction values from chromaticities obtained for all of the LEDs to be classified, respectively.

Abstract: Here is provided a method of producing a starch gel-containing food, the method comprising the steps of: treating starch granules with an enzyme at a temperature of about 10° C. or higher and about 70° C. or lower to obtain an enzyme-treated starch; mixing a food material, the enzyme-treated starch and water to obtain a mixture; heating the mixture thereby gelatinizing the enzyme-treated starch in the mixture; and cooling the mixture containing the gelatinized enzyme-treated starch thereby gelling the starch to obtain a starch gel-containing food, wherein the enzyme is selected from the group consisting of amyloglucosidase, isoamylase, ?-glucosidase, ?-amylase having a characteristic capable of improving a gel forming ability of a starch, and cyclodextrin glucanotransferase.

Abstract: An LED classification device classifies LEDs, the LEDs each including a combination of an LED element that emits a primary light and a phosphor that, upon excitation by the primary light, emits a secondary light having a longer wavelength than the primary light, the LEDs each emitting a combined light of the primary light and the secondary light, those ones of the LEDs whose primary lights having their chromaticities falling within a predetermined chromaticity range being classified as LEDs for use in a backlight of a liquid crystal display apparatus. The LED classification device calculates, for all of the LEDs to be classified, correction values for the chromaticities as obtained on the assumption that the primary lights have traveled through a color filter of the liquid crystal display apparatus, and correct chromaticities by subtracting the correction values from chromaticities obtained for all of the LEDs to be classified, respectively.

Abstract: Here is provided a method of producing a starch gel-containing food, the method comprising the steps of: treating starch granules with an enzyme at a temperature of about 10° C. or higher and about 70° C. or lower to obtain an enzyme-treated starch; mixing a food material, the enzyme-treated starch and water to obtain a mixture; heating the mixture thereby gelatinizing the enzyme-treated starch in the mixture; and cooling the mixture containing the gelatinized enzyme-treated starch thereby gelling the starch to obtain a starch gel-containing food, wherein the enzyme is selected from the group consisting of amyloglucosidase, isoamylase, ?-glucosidase, ?-amylase having a characteristic capable of improving a gel forming ability of a starch, and cyclodextrin glucanotransferase.

Abstract: Here is provided a method of producing a starch gel-containing food, the method comprising the steps of: treating starch granules with an enzyme at a temperature of about 10° C. or higher and about 70° C. or lower to obtain an enzyme-treated starch; mixing a food material, the enzyme-treated starch and water to obtain a mixture; heating the mixture thereby gelatinizing the enzyme-treated starch in the mixture; and cooling the mixture containing the gelatinized enzyme-treated starch thereby gelling the starch to obtain a starch gel-containing food, wherein the enzyme is selected from the group consisting of amyloglucosidase, isoamylase, ?-glucosidase, ?-amylase having a characteristic capable of improving a gel forming ability of a starch, and cyclodextrin glucanotransferase.

Abstract: A semiconductor laser assembly includes a substrate 10 having a first mount surface 10a and a second mount surface 10b, and a submount 3 which is mounted on the first mount surface 10a and which is separate from a monitoring photodiode 4. A laser diode 1 is mounted on the submount 3. The monitoring photodiode 4 is mounted on the second mount surface 10b, and an electrode 4a formed on the monitoring photodiode 4 is used as a relay electrode for a metal wire 5a connected to an upper-surface electrode of the laser diode 1.

Abstract: There is provided a semiconductor laser device which has a semiconductor laser element of a large cavity length and in which an outside shape and outside dimensions of a package are generally identical to those of the conventional one. A mounting portion 10 of a first lead 2 for the semiconductor laser element 1 has a portion that overlaps a second leads 3 in a direction perpendicular to an optical axis direction of laser light emitted from the semiconductor laser element 1, and the first lead 2 and the second leads 3 are integrally retained by a resin member 5 so that the first lead 2 and the second leads 3 are not electrically connected to each other.

Abstract: A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Abstract: A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Abstract: A semiconductor laser assembly includes a substrate 10 having a first mount surface 10a and a second mount surface 10b, and a submount 3 which is mounted on the first mount surface 10a and which is separate from a monitoring photodiode 4. A laser diode 1 is mounted on the submount 3. The monitoring photodiode 4 is mounted on the second mount surface 10b, and an electrode 4a formed on the monitoring photodiode 4 is used as a relay electrode for a metal wire 5a connected to an upper-surface electrode of the laser diode 1.