Patents by Inventor Kenichi KUSAYANAGI

Kenichi KUSAYANAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive sheet, electronic device and onboard device, and method of manufacturing thermally conductive sheet
    Patent number: 11753571
    Abstract: A thermally conductive sheet includes a resin composition including a silicone rubber, and thermally conductive fillers that are anisotropic, the thermally conductive fillers being dispersed in the silicone rubber. A content of the thermally conductive fillers in the resin composition is 52% by volume or more and 75% by volume or less. Major axes of the thermally conductive fillers are oriented in a thickness direction of the thermally conductive sheet, and a ratio of a peak intensity of a (002) plane to a peak intensity of a (100) plane in a spectrum measured from the thickness direction by an X-ray diffraction method is 0.31 or less.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: September 12, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Yumi Yamada, Kenji Osada, Kenichi Kusayanagi
  • THERMALLY CONDUCTIVE SHEET, ELECTRONIC DEVICE, AND ONBOARD DEVICE
    Publication number: 20220112419
    Abstract: A thermally conductive sheet includes a resin composition including a silicone rubber, first thermally conductive fillers that are anisotropic, the first thermally conductive fillers being dispersed in the silicone rubber, and second thermally conductive fillers that are isotropic, the second thermally conductive fillers being dispersed in the silicone rubber. A content of the first thermally conductive fillers in the resin composition is 40% by mass or more and 75% by mass or less. A content of the second thermally conductive fillers in the resin composition is 10% by mass or more and 30% by mass or less. Major axes of the first thermally conductive fillers are oriented in a thickness direction of the thermally conductive sheet.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 14, 2022
    Applicant: Yazaki Corporation
    Inventors: Yumi YAMADA, Kenji OSADA, Kenichi KUSAYANAGI
  • THERMALLY CONDUCTIVE SHEET, ELECTRONIC DEVICE AND ONBOARD DEVICE, AND METHOD OF MANUFACTURING THERMALLY CONDUCTIVE SHEET
    Publication number: 20220115160
    Abstract: A thermally conductive sheet includes a resin composition including a silicone rubber, and thermally conductive fillers that are anisotropic, the thermally conductive fillers being dispersed in the silicone rubber. A content of the thermally conductive fillers in the resin composition is 52% by volume or more and 75% by volume or less. Major axes of the thermally conductive fillers are oriented in a thickness direction of the thermally conductive sheet, and a ratio of a peak intensity of a (002) plane to a peak intensity of a (100) plane in a spectrum measured from the thickness direction by an X-ray diffraction method is 0.31 or less.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 14, 2022
    Applicant: YAZAKI Corporation
    Inventors: Yumi YAMADA, Kenji OSADA, Kenichi KUSAYANAGI