Abstract: A voltage application region and a voltage applying pad form withstand voltage measuring wiring lines insulated from each other and different from each other by connecting a seal ring and a relay region through a via, and the withstand voltage measuring wiring lines different from each other are configured to apply a voltage between insulated seal rings provided on wiring layers adjacent to each other by applying a voltage between the voltage application region and the voltage applying pad.

Abstract: A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

Abstract: A voltage application region and a voltage applying pad form withstand voltage measuring wiring lines insulated from each other and different from each other by connecting a seal ring and a relay region through a via, and the withstand voltage measuring wiring lines different from each other are configured to apply a voltage between insulated seal rings provided on wiring layers adjacent to each other by applying a voltage between the voltage application region and the voltage applying pad.

Abstract: A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

Abstract: A light emitting device includes a first light source unit and a second light source unit that emit three or more types of laser light beams having wavelengths different from each other, a light guide portion in which the laser light beams emitted from both the first light source unit and the second light source unit are guided, and a first heat sink and a second heat sink that respectively hold the first light source unit and the second light source unit at predetermined positions, and dissipate heat generated from the first light source unit and the second light source unit.

Abstract: Provided is a backlight unit capable of reducing luminance unevenness. The backlight unit includes a plurality of dot light sources and a light guide plate in which a predetermined side surface serves as a light incident surface for introducing light from the plurality of dot light sources. The plurality of dot light sources are classified into a first light source group and a second light source group. A mount point of the first light source group and a mount point of the second light source group are displaced from each other in a thickness direction of the light guide plate. A total luminance of the first light source group is higher than a total luminance of the second light source group.

Abstract: An LED substrate comprises holes having an elliptical shape through which fixing screws are inserted. The fixing screw has a head portion, an unthreaded neck portion whose diameter smaller than that of the head portion, and a threaded shaft portion whose diameter smaller than that of the neck portion. A major axis of the hole is larger than the diameter of the head portion, and a minor axis thereof is smaller than the diameter of the head portion and larger than the diameter of the neck portion. The LED substrate further comprises counterbored recesses to which anchoring claws provided in a cabinet are fitted. A width of the counterbored recess in a direction of the major axis of the hole is larger than that of the anchoring claw. The counterbored recesses are formed on both of two sides of the LED substrate facing each other in a first direction.

Abstract: Provided is a backlight unit capable of reducing luminance unevenness. The backlight unit includes a plurality of dot light sources and a light guide plate in which a predetermined side surface serves as a light incident surface for introducing light from the plurality of dot light sources. The plurality of dot light sources are classified into a first light source group and a second light source group. A mount point of the first light source group and a mount point of the second light source group are displaced from each other in a thickness direction of the light guide plate. A total luminance of the first light source group is higher than a total luminance of the second light source group.

Abstract: Provided is a backlight unit capable of increasing luminance and of reducing unevenness in luminance. The backlight unit includes: a light diffusing member provided to cover a light emitting element mounted on a surface of a substrate; and a first light reflective member having a hole portion opened larger in size than an outer shape of the light diffusing member, the first light reflective member being provided on the surface of the substrate while having the light diffusing member protrude from the hole portion. In addition, a second light reflective member is further provided on the surface of the substrate, and the second light reflective member covers at least a part of a region corresponding to a gap left between the light diffusing member and the hole portion of the first light reflective member.

Abstract: An LED substrate comprises holes having an elliptical shape through which fixing screws are inserted. The fixing screw has a head portion, an unthreaded neck portion whose diameter smaller than that of the head portion, and a threaded shaft portion whose diameter smaller than that of the neck portion. A major axis of the hole is larger than the diameter of the head portion, and a minor axis thereof is smaller than the diameter of the head portion and larger than the diameter of the neck portion. The LED substrate further comprises counterbored recesses to which anchoring claws provided in a cabinet are fitted. A width of the counterbored recess in a direction of the major axis of the hole is larger than that of the anchoring claw. The counterbored recesses are formed on both of two sides of the LED substrate facing each other in a first direction.

Abstract: A nonvolatile semiconductor memory device including associating means for associating a faulty block with a redundant block, a block switching circuit for selecting the associated redundant block when a memory block is associated with the redundant block, an error detection circuit for detecting an error in an accessing operation to the memory block, a faulty block identification circuit for identifying the memory block having the detected error as a faulty block when the error is detected and associating the faulty block with the redundant block in the case where the redundant block which is not associated with the faulty block exists.

Abstract: A nonvolatile semiconductor memory device according to the present invention comprises associating means for associating a faulty block with a redundant block, a block switching circuit for selecting the associated redundant block when a memory block is associated with the redundant block, an error detection circuit for detecting an error in an accessing operation to the memory block, a faulty block identification circuit for identifying the memory block having the detected error as a faulty block when the error is detected and associating the faulty block with the redundant block in the case where the redundant block which is not associated with the faulty block exists.