Abstract: An individual wafer separating part separates batched wafers one by one from a slice base mounting beam, and then a shuttle conveyor transports the separated wafers one by one to an individual cleaning part so that the wafers can be cleaned individually. After the cleaning, a detecting part detects the thickness, breaking, chipping and remaining adhesives of the wafers. The wafers are classified in accordance with the results of the detection. Normal wafers are collected in wafer collecting parts, failed wafers are collected in a failed wafer collecting part, and wafers with remaining adhesives are collected into an adhesive remaining wafer collecting part.

Abstract: A running bonded abrasive wire cuts wafers one by one from a slice base, which hold the wafers. The cut wafers are transported on the first conveyor to a collecting part. During the transport process, a CCD camera images the shape of the wafer, and outputs the image data of the wafer to a control unit. The control unit image-processes the image data to recognize whether the transported wafers are normal or inferior. In accordance with the recognition results, the collecting part collects the normal wafers and the inferior wafers separately.

Abstract: Partitions are inserted between different kinds of wafers, which have been sliced from different kinds of ingots by a wire saw. The partitioned wafers are stored in a cassette, and are soaked in hot water with the cassette. The wafers are separated from slice base mounting beams. After the separation, the wafers are retrieved into the cassette in the state of being partitioned between the wafer lots.

Abstract: A mounting beam removal equipment has a cassette for holding a plurality of stacked wafers in such a manner that mounting beams of the wafers are trued up in the same direction, a brush composed of a plurality of disks which are inclined at a predetermined angle and secured to a vertical shaft along an axis of the vertical shaft at regular intervals, the brush facing a side of the mounting beams of the wafers held in said cassette. Furthermore, a rotation driving device is provided for rotating the brush about the axis of said vertical shaft, a first moving device is provided for moving the brush horizontally along the side of the mounting beams, and a second moving device is provided for moving the brush horizontally in a direction perpendicular to the side of the mounting beams.