Patents by Inventor Kenichi Namba

Kenichi Namba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6839367
    Abstract: A light source including at least one laser diode module and a heat pipe having a heat absorbing portion and a heat radiating portion. The laser diode module includes a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with the metal substrate. The heat absorbing portion of the heat pipe is thermally connected with the peltier device. The light source preferably includes a plurality of densely placed laser diode modules, each of which has an output of at least 100 mW. The light source also preferably includes a plurality of heat pipes having heat radiating fins on the heat radiating portions thereof.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: January 4, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shinya Nagamatsu, Kenichi Namba, Shu Namiki
  • Publication number: 20030142712
    Abstract: A small-sized light source of laser diode modules includes a plurality of coolerless laser diode modules without built-in Peltier devices arranged in a dense cluster, where each module includes a laser diode chip, optical components, a metal substrate with the laser diode chip and the optical components mounted thereon. It further includes a plurality of laser diode modules with a built-in cooler, where each module includes a laser diode chip, optical components, a metal substrate with the laser diode chip and the optical components mounted thereon, and a Peltier device thermally connected to the metal substrate.
    Type: Application
    Filed: March 13, 2002
    Publication date: July 31, 2003
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Masami Ikeda, Kenichi Namba
  • Patent number: 6397935
    Abstract: A flat type heat pipe for mounting a heating power element, which is capable of forming an optionally shaped heat transferring path with high accuracy, which is of a thin type and to which fins are easily attached. The flat type heat pipe includes at least two aluminum plates substantially in parallel with each other and brazed to each other so as to form a heat transferring path therebetween. The flat type heat pipe also includes an operating liquid which fills the heat transferring path. Because the heat transferring path 25 is formed by means of press molding, punching, laser beam machining, or cutting various shapes of heat transferring paths can be formed finely and with high accuracy. The flexible flat type heat pipe can be made thin, which allows for a variety of uses. Grooves and wicks can be disposed in the heat transferring path, thereby improving the heat conductivity. Because the surface is flat, the fins can be easily attached thereto, thereby a satisfactory radiation effect can be obtained.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: June 4, 2002
    Assignee: The Furukawa Electric Co. Ltd.
    Inventors: Masaaki Yamamoto, Jun Niekawa, Yuichi Kimura, Kenichi Namba
  • Publication number: 20020056542
    Abstract: A flat type heat pipe for mounting a heating power element, which is capable of forming an optionally shaped heat transferring path with high accuracy, which is of a thin type and to which fins are easily attached. The flat type heat pipe includes at least two aluminum plates substantially in parallel with each other and brazed to each other so as to form a heat transferring path therebetween. The flat type heat pipe also includes an operating liquid which fills the heat transferring path. Because the heat transferring path 25 is formed by means of press molding, punching, laser beam machining, or cutting various shapes of heat transferring paths can be formed finely and with high accuracy. The flexible flat type heat pipe can be made thin, which allows for a variety of uses. Grooves and wicks can be disposed in the heat transferring path, thereby improving the heat conductivity. Because the surface is flat, the fins can be easily attached thereto, thereby a satisfactory radiation effect can be obtained.
    Type: Application
    Filed: November 30, 2001
    Publication date: May 16, 2002
    Inventors: Masaaki Yamamoto, Jun Niekawa, Yuichi Kimura, Kenichi Namba
  • Publication number: 20020054615
    Abstract: A light source including at least one laser diode module and a heat pipe having a heat absorbing portion and a heat radiating portion. The laser diode module includes a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with the metal substrate. The heat absorbing portion of the heat pipe is thermally connected with the peltier device. The light source preferably includes a plurality of densely placed laser diode modules, each of which has an output of at least 100 mW. The light source also preferably includes a plurality of heat pipes having heat radiating fins on the heat radiating portions thereof.
    Type: Application
    Filed: March 16, 2001
    Publication date: May 9, 2002
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinya Nagamatsu, Kenichi Namba, Shu Namiki