Abstract: The present invention provides an item registration apparatus and a measuring device cooperating with a mobile terminal to allow smooth registration of sold-by-weight items being purchased by a customer. The item registration apparatus comprises: a measuring device having a weighing tray on which an item is put; and a mobile terminal which can be connected to the measuring device via communication channel (access point or the like). When the item is put on said weighing tray of the measuring device and the measurement of the item is thus completed, the measuring device transmits transaction information of the measured item to the mobile terminal via the communication channel so that the transaction information is stored. This eliminates printing of code information on a label issued from the measuring device and operation of scanning the printed code information by using the mobile terminal.

Abstract: A commodity sales data processing device that processes sales data relating to a commodity includes a memorizing part (such as a RAM 3) that memorizes commodity data including unit mass information of a commodity, an imaging part that images a commodity, a quantity specifying part that specifies the number of commodities based on the picture data taken by the imaging part, a measuring part that measures the mass of the commodity, a number calculating part that calculates the number of commodities based on the mass of the commodity measured by the measuring part and the commodity data memorized in the memorizing part, a judging part that judges whether or not the number of commodities specified by the quantity specifying part and the number of commodities calculated by the number calculating part match, and an informing part that informs the result of judgment by the judging part.

Abstract: A commodity sales data processing device that processes sales data relating to a commodity includes a memorizing part (such as a RAM 3) that memorizes commodity data including unit mass information of a commodity, an imaging part that images a commodity, a quantity specifying part that specifies the number of commodities based on the picture data taken by the imaging part, a measuring part that measures the mass of the commodity, a number calculating part that calculates the number of commodities based on the mass of the commodity measured by the measuring part and the commodity data memorized in the memorizing part, a judging part that judges whether or not the number of commodities specified by the quantity specifying part and the number of commodities calculated by the number calculating part match, and an informing part that informs the result of judgment by the judging part.

Abstract: The present invention provides an item registration apparatus and a measuring device cooperating with a mobile terminal to allow smooth registration of sold-by-weight items being purchased by a customer. The item registration apparatus comprises: a measuring device having a weighing tray on which an item is put; and a mobile terminal which can be connected to the measuring device via communication channel (access point or the like). When the item is put on said weighing tray of the measuring device and the measurement of the item is thus completed, the measuring device transmits transaction information of the measured item to the mobile terminal via the communication channel so that the transaction information is stored. This eliminates printing of code information on a label issued from the measuring device and operation of scanning the printed code information by using the mobile terminal.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: The component mounting equipment (30) mounts an FPC board (12) on an LCD board (11). The LCD board (11) has a first electrode section (11b) on one side edge and a second electrode section (11c) on another side edge. The FPC board (12) has a first section (12a) on one side edge and a second section (12b) on other side edge. A first mounting apparatus (31) mounts the first section (12a) on the first electrode section (11b). A second mounting apparatus (32) mounts the second section (12b) on the second electrode section (11c). In the second component mounting apparatus (32), the second section (12b) is separated from the second electrode section (11b) at an ACF supply section (170) and released at a pre-press bonding section (180).

Abstract: A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

Abstract: A beating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

Abstract: In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.

Abstract: A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).

Abstract: A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Abstract: A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead.

Abstract: Curable unsaturated polyester resin compositions from which molded products with superior surface smoothness can be obtained include a block copolymer of a specified form, an unsaturated polyester, a vinyl monomer, a filler, a curing catalyst and a reinforcing fiber. The block copolymer is of the form A--(B).sub.n where A is non-hydrogenated polyisoprene block having viscosity average molecular weight of 10000 or more, B is saturated polyester block obtainable by condensation of organic dicarboxylic anhydride and 1,2-epoxide, more than 50 mol % of terminal groups of the polyester block being carboxylic acid group, A and B are connected by ester linkage and n is not less than 2. Block copolymers of this type can be formed by starting with carboxylic acid or hydroxyl group in polyisoprene and by alternate condensation of organic dicarboxylic anhydride and 1,2-epoxide.

Abstract: A curable unsaturated polyester resin composition contains graft copolymers each having 10-60 weight % of a first constituent given by ##STR1## 38-89.7 weight % of a second constituent given by ##STR2## and 0.3-2 weight % of a third constituent which is a vinyl monomer unit having carboxylic acid or carboxylic anhydride groups, unsaturated polyester, vinyl monomer, a filler, a curing catalyst, and reinforcing fibers, where either of R.sup.1 and R.sup.2 is H, the other being either H or CH.sub.3, R.sub.3 is ethylene group or propylene group, R.sup.4 is hydrocarbon group with 1-18 carbton atoms, R.sup.5 is alkyl group with 1-4 carbon atoms, R.sup.6 is alkyl group with 1-3 carbon atoms, m is 6-90 and n is 1-5.