Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: Disclosed is a metal-clad laminate and a method for producing a metal-clad laminate wherein adhesion between a metal layer and a thermoplastic film serving as a base material is improved, the deposition rate of a plating coat on the base material is improved, and the insulating resistance after etching is properly adjusted at the same time. The metal-clad laminate comprises a base material that is composed of a thermoplastic polymer film, a base metal layer that is provided on the surface of the base material, and an upper metal layer that is provided on the surface of the base metal layer. The base metal layer is made of a copper alloy that contains 0.05-0.21 mass % of phosphorus, and the upper metal layer is made of copper or a copper alloy.

Abstract: A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.

Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: With respect to a metal clad laminate wherein a metal layer is to be formed for at least a part of a surface of a flexible polymer film, it becomes clear that it is able to suppress any warpage of the laminate by performing a heat treatment and then a cooling treatment under a state of loading a tension within a range capable of maintaining the laminate to be a flat configuration consistently during the period from heating to cooling. Moreover, it becomes clear that it is able to suppress the warpage without occurrences of an elongation deformation and/or a fracture for the obtained metal clad laminate, by controlling a tension to be loaded at the period of the heat treatment as between 0.03% and 0.3% of a tensile strength in a direction of the tension for the substratum polymer film.

Abstract: A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.